A three-axis dynamic loading device for mems microstructure based on piezoelectric ceramics

Abstract

The invention discloses a MEMS microstructure three-axis dynamic loading device based on piezoelectric ceramics, which includes a sleeve, stacked piezoelectric ceramics, a pressure sensor, upper and lower connecting blocks and a MEMS microstructure; Support plate and electric screw drive mechanism; spherical protrusions and spherical grooves are respectively provided between the upper and lower connecting blocks; stacked piezoelectric ceramics are clamped between the pressure sensor and the elastic support; outside the upper connecting block The edge is connected with mounting blocks through connecting rods evenly distributed on the circumference, and ball plungers are respectively installed on the mounting blocks, and the steel balls at the outer ends of the ball plungers are pushed into the rectangular grooves on the outer wall of the sleeve. The device can more flexibly apply different sizes of pre-tightening force to the stacked piezoelectric ceramics, so that the obtained pre-tightening force measurement value is more accurate, and the adjustment process of compensating the parallelism error of the two working surfaces of the stacked piezoelectric ceramics can be changed. It is smoother and smoother, reducing the shear force between the layers of the stacked piezoelectric ceramics, and it is convenient to test the dynamic characteristic parameters of the MEMS microstructure.

Description

technical field [0001] The invention belongs to the technical field of micromechanical electronic systems, in particular to a MEMS microstructure three-axis dynamic loading device based on piezoelectric ceramics. Background technique [0002] Due to the advantages of low cost, small size and light weight, MEMS microdevices have broad application prospects in many fields such as automobile, aerospace, information communication, biochemistry, medical treatment, automatic control and national defense. For many MEMS devices, the micro-displacement and micro-deformation of their internal microstructures are the basis for the realization of device functions. Therefore, accurate testing of dynamic characteristic parameters such as the amplitude, natural frequency, and damping ratio of these microstructures has become the key to developing MEMS products. important content. [0003] In order to test the dynamic characteristic parameters of the microstructure, it is first necessary t...

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Problems solved by technology

[0006] 2. There is no direct connection between the upper connection block and the lower connection block and the sleeve, but are installed in the sleeve in turn by means of clearance fit. If the parallelism error of the two working surfaces of the stacked piezoelectric ceramics is large , there is not enough space to adjust the movable base structure;

[0007] 3. The pressure sensor is installed at the bottom of the lower connecting block. Since the movable base structure adjusts itself, there is a certain inclination between the bottom of the lower connecting block and the working surface of the piezoelectric ceramic, so the pre-tightening force measured by the pressure sensor Or the output force of piezoelectric ceramics is not accurate; in addition, if the movable base structure causes the upper coupling block or the lower coupling block to contact the sleeve after adjustment, the error of the measurement result will further increase;

[0009] 5. In this device, gaskets of different thicknesses are used to change the magnitude of the pre-tightening force applied to the stacked piezoelectric ceramics, which makes the adjustment process complicated and not flexible enough

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