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Multilayer ceramic capacitor and method for manufacturing the same

A technology of multilayer ceramics and capacitors, which is applied in the direction of laminated capacitors, fixed capacitor electrodes, fixed capacitor dielectrics, etc., and can solve problems such as insulation resistance degradation

Active Publication Date: 2021-10-29
TAIYO YUDEN KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

On the other hand, Japanese Patent Application Laid-Open No. 2016-66783 discloses that even if Ni is used for the internal electrode layer, insulation resistance deteriorates due to the influence of hydrogen

Method used

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  • Multilayer ceramic capacitor and method for manufacturing the same
  • Multilayer ceramic capacitor and method for manufacturing the same
  • Multilayer ceramic capacitor and method for manufacturing the same

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Embodiment approach

[0016] A description will be given of a multilayer ceramic capacitor. figure 1 A partial perspective view of multilayer ceramic capacitor 100 is shown. Such as figure 1 As shown, the multilayer ceramic capacitor 100 includes a multilayer chip 10 having a rectangular parallelepiped shape and a pair of external electrodes 20 a and 20 b respectively provided at two edge faces of the multilayer chip 10 facing each other. The four surfaces other than the two edge surfaces of the multilayer chip 10 are called side surfaces. The external electrodes 20a and 20b extend to four sides. However, the external electrodes 20a and 20b are spaced apart from each other on four sides.

[0017] The multilayer chip 10 has a structure designed to have alternately stacked dielectric layers 11 and internal electrode layers 12 . The dielectric layer 11 includes a ceramic material used as a dielectric material. End edges of the internal electrode layer 12 are alternately exposed to a first edge fa...

Embodiment 1-6

[0049] The additive compound is added to the barium titanate powder. The obtained barium titanate powder was fully wet-mixed and pulverized. Thus a dielectric material is obtained. Organic binders and solvents are added to the dielectric material. And a dielectric green sheet was prepared by a doctor blade method. The thickness of the dielectric green sheet was 0.8 μm. The organic binder is polyvinyl butyral (PVB) resin or the like. The solvent is ethanol, toluene or the like. And add plasticizer etc. Next, a conductive paste for forming the internal electrode layer is prepared by mixing a powder serving as a main component metal of the internal electrode layer 12 , a binder, a solvent, and additives as necessary. Organic binders and solvents are different from those in dielectric green sheets. The conductive paste was screen printed on the dielectric sheet. 250 dielectric green sheets having a conductive paste for forming an internal electrode layer thereon were stack...

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Abstract

The present application provides a multilayer ceramic capacitor, which includes: a multilayer chip having a parallelepiped shape, wherein each of a plurality of dielectric layers is alternately stacked with each of a plurality of internal electrode layers and is alternately exposed to Two edge faces of a multilayer chip, a plurality of dielectric layers having a main component of ceramics; and a pair of external electrodes formed on the two edge faces; wherein: said pair of external electrodes has a structure in which a plating layer is formed on a base layer ; the main component of the base layer is a metal or alloy containing at least one of Ni and Cu; and the base layer contains Mo.

Description

technical field [0001] Certain aspects of the present invention relate to a multilayer ceramic capacitor and a method of manufacturing the multilayer ceramic capacitor. Background technique [0002] A multilayer ceramic capacitor has a multilayer structure in which a plurality of dielectric layers and a plurality of internal electrode layers are alternately stacked, and a pair of external electrodes formed on edge faces of the multilayer structure and It is electrically connected to the internal electrode layer drawn out to the edge face. The external electrodes have a structure in which the base layer is plated. Japanese Patent Application Laid-Open No. H01-80011 discloses that hydrogen generated in plating is adsorbed in the internal electrode layer, and the insulation resistance of the dielectric layer deteriorates due to reduction by hydrogen. Also, the patent literature discloses that Ni (nickel) is added as a metal for suppressing hydrogen adsorption of internal elec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/232H01G4/30H01G4/12
CPCH01G4/2325H01G4/30H01G4/12H01G4/252H01G4/008
Inventor 柳泽笃博柴田好规田原干夫
Owner TAIYO YUDEN KK