A special gold-plated pad manufacturing method

A manufacturing method and pad technology, applied in the reinforcement of conductive patterns, the formation of electrical connections of printed components, the secondary treatment of printed circuits, etc., can solve the problem of board scrapping, corrosion of nickel plating layer, easy to be electroplated with copper or tin, etc. problems, to achieve the effect of quality assurance
CN108235598BActive Publication Date: 2019-10-18SHENNAN CIRCUITS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENNAN CIRCUITS
Publication Date
2019-10-18

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Abstract

The invention discloses a special manufacturing method for a gold-plated bonding pad. The method comprises the following steps: supplying a multi-layer plate, wherein one or a plurality of gold plating patterns are designed in a gold plating area on the surface of the multi-layer plate; protecting by utilizing a dry film, and locally electroplating one or more gold plating patterns with nickel gold; protecting the one or more gold plating patterns and a non-gold-plating area by utilizing films; etching the gold plating area to obtain one or more gold plating patterns as the gold-plated bondingpad; arranging anti-plating oil on the one or more gold plating patterns for protection, wherein the anti-plating oil is covered with an anti-plating film; protecting by utilizing the dry film; electroplating the surface patterns of the multi-layer plate with copper and tin; etching after removing the films to form a circuit pattern on the surface of the multi-layer plate; removing a tin layer onthe surface of the circuit pattern; and removing the anti-plating oil. According to the method, the gold plating patterns are etched in advance and are protected by the anti-plating oil, so that problems in the prior art can be solved or reduced.
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Description

technical field

[0001] The invention relates to the technical field of PCB, in particular to a special gold-plated pad manufacturing method. Background technique

[0002] Some special PCB (Printed Circuit Board, printed circuit board) products require the gold-plated pads from the window to be lower than other graphics; for example, for some PCBs used in bonding, the gold-plated pads required to be bonded are lower than other graphics 20- 50um. This type of product also has some pads that are electro-gold first and then copper-plated. Therefore, the electro-gold area is larger than the gold-plated pads that come out of the last window.

[0003] The production process of the prior art includes the following processes:...outer lamination → drilling → copper flash plating → dry film application, exposure, development → electro-gold → film fading → dry film application, exposure, development → graphic copper plating, Tin→film stripping→etching→pasting dry film, exposure, devel...

Claims

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