Novel computer heat dissipation device

A heat dissipation device and computer technology, applied in the field of computers, can solve problems affecting the life of the motherboard and the stability of the computer, and achieve the effects of improving work stability, stabilizing the heat dissipation process, and increasing the contact area

Active Publication Date: 2018-07-06
山东开亿基因科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the existing computers, there is no structure for cooling the main board, which not only affec

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  • Novel computer heat dissipation device
  • Novel computer heat dissipation device

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Example Embodiment

[0020] The following are specific embodiments of the present invention in conjunction with the accompanying drawings to further describe the technical solutions of the present invention, but the present invention is not limited to these embodiments.

[0021] Such as figure 1 with figure 2 As shown, the computer includes a case 1, and the inside of the case 1 is a cavity. The new computer heat dissipation device is composed of aluminum plate 2, heat dissipation pipe 3, heat dissipation fan 4, positioning pipe 5 and so on. Wherein, the heat pipe 3 is made of a thermally conductive material, and the thermally conductive material can be aluminum alloy or brass.

[0022] Specifically, the aluminum plate 2 is in the shape of a flat plate and is fixed in the cabinet 1 in the vertical direction. At this time, the length of the aluminum plate 2 extends in the vertical direction. There are two aluminum plates 2 and they are arranged side by side. The two aluminum plates 2 are distributed ...

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Abstract

The invention provides a novel computer heat dissipation device. A computer comprises a machine case. The novel computer heat dissipation device comprises two aluminum plates, wherein the aluminum plates are vertically and fixedly arranged in the machine case, extend along the vertical direction, are of a flat shape, are arranged in parallel and are distributed along the thickness, a gap is formedbetween the two aluminum plates, heat dissipation pipes are vertically arranged in the gap, are of a hollow straight pipe shape and are produced from heat conducting materials, two side walls of theheat dissipation pipes respectively prop against the two aluminum plates, the heat dissipation pipes are uniformly distributed along the width directions of the aluminum plates, the upper ends of theheat dissipation pipes are bent towards one sides so as to form straight-pipe-shaped dustproof parts, and the dustproof parts are arranged along the horizontal direction; and a heat dissipation hole is formed in the middle of one aluminum plate along the thickness of the aluminum plate and directly faces towards the heat dissipation pipes, and a heat dissipation fan is fixed in the heat dissipation hole. The novel computer heat dissipation device has the advantage of high heat dissipation efficiency.

Description

technical field [0001] The invention relates to a computer, in particular to a novel computer cooling device. Background technique [0002] A computer, commonly known as a computer, is a modern electronic computing machine used for high-speed computing. It can perform numerical calculations, logical calculations, and has storage and memory functions. [0003] A computer is composed of a hardware system and a software system, and a computer without any software installed is called a bare metal. It can be divided into five categories: supercomputers, industrial control computers, network computers, personal computers, and embedded computers. More advanced computers include biological computers, photonic computers, and quantum computers. [0004] In existing computers, the CPU is installed on the motherboard. When the CPU is working, it will emit a lot of heat, some of which will be taken away by the fan, and the other part of the heat will be transferred to the motherboard f...

Claims

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Application Information

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IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 牛磊落张梦梅
Owner 山东开亿基因科技有限公司
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