Multi-dimension compatible LED thickness detection automation device and detection method thereof
An automated equipment, thickness detection technology, applied in the direction of semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., can solve problems such as low detection efficiency, inability to meet wafer yield, etc., to improve detection efficiency, improve detection accuracy, cost saving effect
Active Publication Date: 2018-07-17
无锡星微科技有限公司
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Problems solved by technology
[0003] In the current industry, the detection equipment is manually loaded, and the detection efficiency is low, which can no longer meet the increasing wafer output. Therefore, an automatic wafer thickness detection equipment to meet the output is particularly necessary.
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Embodiment 1
[0043] see Figure 1-6 , the present invention provides the following technical solutions: a multi-size compatible automatic equipment for LED thickness detection, including a wafer cassette library 1, a manipulator 2, a pre-alignment platform 3 and a marble air flotation table 4, and one side of the manipulator 2 is provided with Wafer cassette warehouse 1, a pre-alignment platform 3 is set on the other side of the manipulator 2 and at a position 90 degrees to the wafer cassette warehouse 1, and a marble air flotation table is set on the side of the manipulator 2 away from the wafer cassette warehouse 1 4;
[0044]The inside of the wafer cassette library 1 is provided with wafer cassette adapters 11. There are twelve wafer cassette adapters 11 in total. The twelve wafer cassette adapters 11 are divided into upper and lower layers. One side of the wafer cassette adapter 11 A second sensor 14 is arranged on one side, and a first sensor 13 is arranged on a side of the second se...
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The invention discloses a multi-dimension compatible LED thickness detection automation device which comprises a wafer box library, a manipulator, a pre-alignment platform and a marble air floating table, wherein the wafer box library is arranged on one side of the manipulator, the pre-alignment platform is arranged at the other side of the manipulator and at a position of ninety degrees with thewafer box library; due to the fact that the 12 wafer libraries are adopted, and the method for grabbing and placing wafers through the manipulator is adopted, compared with the manner of manual placing of wafers and single-piece detection, the detection efficiency is greatly improved; according to the invention, the pre-alignment platform part is added before final detection, so that the placementand positioning precision of the wafers are far higher than that of manual placement, the detection precision is greatly improved; due to the fact that the detection table adopts the marble air floating platform, compared with a traditional mechanical detection platform, the mechanical detection platform is more excellent in platform performance, and the detection precision is greatly improved.
Description
technical field [0001] The invention belongs to the technical field of LED thickness detection equipment, and in particular relates to a multi-size compatible automatic equipment for LED thickness detection and a detection method thereof. Background technique [0002] With the rapid development of the domestic semiconductor industry in recent years, the demand for wafers has also greatly increased. Wafers refer to silicon wafers used in the production of silicon semiconductor integrated circuits. The size can be divided into 2 inches, 4 inches, and 6 inches according to the diameter. , 8 inches, 12 inches, etc.; in the production process of the wafer, it will go through a series of processes such as cutting, grinding, polishing, etc. The thickness of the wafer has an important impact on its subsequent processing and production. It is very necessary to inspect the thickness of the wafer after a process. [0003] In the current industry, the inspection equipment is manually l...
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IPC IPC(8): H01L21/66H01L33/00
CPCH01L33/005H01L22/12H01L22/30
Inventor 周俊晨陆敏杰
Owner 无锡星微科技有限公司