A coupling molding method of an optical transmission device

Abstract

The invention relates to an optical transmission device coupling and forming method. The method comprises the following steps in sequence: pattern making, photomask making, preparation of an optical chip and a fiber array wafer through a photomask, preparation of a fiber array strip by bonding an optical fiber to the fiber array wafer, coupling and packaging of the optical chip and the fiber arraystrip, and carrying out cutting according to the required number of optical transmission devices. In the method, through design and layout of the optical chip and the fiber array pattern, a wafer substrate is selected, and space between groups and space between optical channels in each group on an optical chip strip are allowed to be same with corresponding space on an input end fiber array stripand an output end fiber array strip under the same process; and during coupling and packaging, simultaneous coupling of a plurality of optical transmission devices can be realized at one time only byaligning two outermost-edge optical channels of each strip instead of aligning all optical channels on by one, thereby improving work efficiency and reducing cost.

Description

technical field [0001] The invention relates to a coupling molding method, in particular to a coupling molding method of an optical transmission device capable of simultaneously coupling multiple optical transmission devices at one time. Background technique [0002] With the rapid development of clusters and network computing systems in optical communication and computer fields in recent years, the communication capacity has increased sharply. In this case, large capacity is no longer the only goal to be pursued. In some high-speed systems, the demand for parallel optical communication is also increasing. Driven by a strong market, a large number of new active devices and passive devices used in the information field have emerged. Surface-emitting laser array VCSEL (Vertical-Cavity Surface-Emitting Laser) chips for broadband and high-speed fields, light-receiving PIN (photodiode) chips, multiplexing, demultiplexing, and optical splitting for various purposes Planar wavegu...

AI Technical Summary

Problems solved by technology

[0003] At present, the conventional method of making this kind of device on the market is to cut and manufacture the optical chip, the input fiber array and the output fiber array using a grinding wheel dicing machine, and then couple and package them into a complete optical device. Only one can be coupled at a time. Optical devices, low efficiency, high cost

Images