Rapid cooling device for switch

Abstract

The invention discloses a rapid cooling device for a switch and belongs to the communication appliance accessory equipment field. According to the rapid cooling device for the switch of the invention,heat generated by the chip of a switch is utilized to expand a first telescopic bladder and a second telescopic bladder, and then the expansion of the first telescopic bladder and the second telescopic bladder acts as an impetus to push a sliding block which has absorbed heat to slide outside to contact with a cooling mechanism, so that heat dissipation can be carried out, and therefore, the heataccumulated inside the switch is radiated to the outside through the sliding block protruding out from a switch shell; and the sliding block and a slide rail are driven to be reset by means of the contraction of the first telescopic bladder and the second telescopic bladder, so that the sliding block contacts with the chip again to absorb the heat; and therefore, the sliding block can automatically reciprocate inside and outside the switch so as to realize rapid heat dissipation. With the rapid cooling device for the switch of the invention adopted, the problem that heat dissipated by the heat dissipation sheets of an existing switch still stays inside the switch can be solved; heat inside the switch can be absorbed and dissipated to the outside of the switch, so that rapid and effectiveheat dissipation can be realized; and heat dissipation efficiency can be improved by means of contact type heat dissipation.

Description

technical field [0001] The invention relates to the field of communication equipment accessories, in particular to a rapid cooling device for switches. Background technique [0002] A switch is a network device used for electrical signal forwarding. As an access device in various networks, it can provide exclusive electrical signal paths for any two network nodes connected to the switch, and is an important support to ensure network performance. [0003] With the development of network technology, higher requirements are placed on the performance and reliability of switches. Not only is it required that the switch can quickly forward electrical signals, but it is also required to be able to withstand the test of various harsh external environments. However, as the switch port density becomes higher, the rate becomes faster, and the function becomes more powerful, the power consumption of the switch increases and the system temperature becomes higher. Excessive system temp...

AI Technical Summary

Problems solved by technology

[0006] 1. The heat sink is installed in the switch. The heat emitted by the heat sink into the air still stays inside the switch. The temperature inside the switch is still higher than the temperature outside the switch. The heat dissipation effect is not obvious, and the heat dissipation problem cannot be completely solved. performance of the switch

[0007] 2. The existing heat sink dissipates heat into the air, but there is no cooling device in direct contact with the heat sink, resulting in low heat dissipation efficiency

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