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Silicone resin composition and sealing material for semiconductor light emitting element

A technology of resin composition and silicone, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electrical components, etc., and can solve the problems of low UV light extraction efficiency, poor refractive index, and large refractive index difference.

Inactive Publication Date: 2018-08-03
SUMITOMO CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the refractive index difference at the interface between the gap and the surface of the UV-LED, and the refractive index difference at the interface between the gap and the surface of the quartz glass are large, the UV light will be reflected, and there is an extraction efficiency of the UV light. low such problems

Method used

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  • Silicone resin composition and sealing material for semiconductor light emitting element
  • Silicone resin composition and sealing material for semiconductor light emitting element
  • Silicone resin composition and sealing material for semiconductor light emitting element

Examples

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Embodiment 1

[0227] As the first silicone resin, a silicone resin 1 having an organopolysiloxane structure represented by the above formula (1) (Mw=3500, in the above formula (1), R 1 = Methyl, R 2 = methoxy or hydroxyl). Table 1 shows the abundance ratio of each structural unit of the silicone resin 1.

[0228] [Table 1]

[0229]

[0230] When the silicone resin 1 was heated from room temperature to 200° C. at a temperature increase rate of 5° C. / min and held in air at 200° C. for 5 hours, the mass loss rate was 10.3%.

[0231] As the second silicone resin, MSP-S110 (manufactured by NIKKO RICA CORPORATION) was used. The mass loss rate when MSP-S110 was heated from room temperature to 200°C at a temperature increase rate of 5°C / min and kept in air at 200°C for 5 hours was 3.5%. Table 2 shows the abundance ratio of each structural unit of MSP-S110.

[0232] [Table 2]

[0233]

[0234] 35.04 g of silicone resin 1, 23.36 g of MSP-S110 as the second silicone resin, and 21.60 g of 2...

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Abstract

A silicone resin composition is provided which is useful in the production of a highly UV-stable cured product of a silicone resin composition. This silicone resin composition includes at least one silicone resin and satisfies conditions (i) to (iii) below. (i) The contained silicon atoms consist essentially of A3 silicon atoms and at least one type of silicon atom selected from the group consisting of A1 silicon atoms and A2 silicon atoms, and the ratio of the content of A3 silicon atoms to the total content of A1 silicon atoms, A2 silicon atoms and A3 silicon atoms is 50-99 mol%. (ii) Side chains binding to the silicon atoms are alkyl groups of 1 to 3 carbon atoms, alkoxy groups of 1 or 2 carbon atoms, or hydroxyl groups, the molar ratio of the alkoxy groups to the alkyl groups is less than 5 to 100, and the molar ratio of the hydroxyl groups to the alkyl groups is greater than or equal to 10 to 100. (iii) Contains essentially no metal catalysts.

Description

technical field [0001] The invention relates to a silicone resin composition and a packaging material for a semiconductor light-emitting element. More specifically, the present invention relates to a silicone resin composition, a cured product of the silicone resin composition, and a semiconductor light-emitting device encapsulating material formed from the cured product of the silicone resin composition. Background technique [0002] In recent years, UV (ultraviolet light)-LEDs have started to appear on the market. Quartz glass is usually used in the packaging of UV-LEDs. However, since quartz glass is expensive, the product price becomes expensive, and there is a problem that market competitiveness is lowered. In addition, when the UV-LED is encapsulated using quartz glass, there is a gap (encapsulation gap) between the UV-LED and the quartz glass. Because the refractive index difference at the interface between the gap and the surface of the UV-LED, and the refractive ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/06C08G77/14C08L83/04H01L23/29H01L23/31H01L33/56
CPCC08L83/06C09D183/06C08G77/14C08L83/04H01L23/29H01L23/31H01L33/56C08L83/00C08G77/16C08G77/18C08L2203/206
Inventor 堀田翔平高岛正之
Owner SUMITOMO CHEM CO LTD
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