A shielding frame and chemical vapor deposition device

Abstract

The invention discloses a masking frame. The masking frame can be combined with a bearing platform so as to mask the surrounding area of a substrate positioned on the bearing platform. The masking frame comprises a masking outer frame and a masking inner frame, wherein one surface of the masking outer frame, separating from the bearing platform, is convexly provided with at least one limiting device; the masking inner frame is sheathed with the masking outer frame by the limiting device, so that the masking inner frame is fixed relatively to the horizontal direction of the masking outer frame,but is movable in the vertical direction. The invention also discloses a chemical vapor deposition device comprising the masking frame. By the structure, good laminating effect of the masking frame and the substrate is good.

Description

technical field [0001] The invention relates to the field of liquid crystal display, in particular to a shielding frame and a chemical vapor deposition device. Background technique [0002] Modern semiconductor devices require deposition and removal of multiple layers of conductive, semiconductive, and dielectric materials from glass substrates to form features, such as organic light emitting diodes (OLEDs), transistors, and low-k dielectric films. Glass substrate processing techniques include chemical vapor deposition (CVD), physical vapor deposition (PVD), plasma enhanced chemical vapor deposition (PECVD), etching, and the like. Plasma processing is widely used in the production of flat panel devices because of the relatively low processing temperatures required to deposit thin films, and the good film quality that can result from the use of plasma processing. [0003] During processing, the edges and backs of glass substrates and components inside the chamber must be pro...

AI Technical Summary

Problems solved by technology

[0004] Considering the advantages of using a shadow frame, the current shadow frame design has some disadvantages

The shielding frame used in the prior art is an aluminum base, and the surface is anodized to achieve the purpose of insulation. Because the aluminum material is soft, it is easy to deform, resulting in insufficient shielding to produce film halo or excessive pressure on the glass substrate, resulting in fragmentation. Normal operation of the machine, production

In addition, during the chemical vapor deposition (Chemical Vapor Deposition, CVD) process, the temperature is 340 / 360, 275 / 285 degrees Celsius, and the anode on the surface of the aluminum material is likely to cause anode peeling due to the different thermal expansion coefficients during the process, and the generated particles will affect the product. Yield

[0005] Moreover, in the production process, due to the different thickness of the adapted glass substrate (0.4-0.7mm) and the deformation of the mechanical frame after being stressed, it will cause abnormal products. The shielding frame has a gap to separate the shielding frame from the edge surface of the substrate. If the gap is too large, the gas or plasma will reach the edge and back of the substrate, and electric breakdown will occur. If the gap is too small, the glass substrate will be pressed and the substrate will be damaged.

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