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An LED filament light source flip-chip structure

A technology for LED filaments and light sources, which is applied to coupling devices, parts of connecting devices, and modification through conduction and heat transfer. Long service life, excellent performance, and good heat dissipation effect

Active Publication Date: 2020-01-03
常德非凡照明电器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under the existing technology, the heat dissipation effect of the ordinary flip-chip structure LED is not good, and the high temperature will easily cause the aging of the components, affecting the performance and service life

Method used

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  • An LED filament light source flip-chip structure
  • An LED filament light source flip-chip structure
  • An LED filament light source flip-chip structure

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Embodiment Construction

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0018] refer to Figure 1-4 , an LED filament light source flip-chip structure, including a ceramic substrate 1, a heat dissipation groove is opened inside the ceramic substrate 1, and one end of two symmetrically arranged connecting pipes 2 is connected through the heat dissipation groove, and the other end of the two connecting pipes 2 runs through The same installation box 3 is connected, the inner side wall of the installation box 3 is fixedly connected with the first electromagnet 4, the side wall of the first electromagnet 4 is connected with the conductive contact plate 6 through the first spring, the side wall of the first electromagnet 4 The conductive rod 5...

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Abstract

The invention discloses an LED lamp filament light source inversion structure. A heat dissipation groove is formed in a ceramic substrate; the heat dissipation groove is connected with one ends of twosymmetrically arranged connecting tubes in a run-through manner, and the other ends of two connecting tubes are connected with the same mounting box in a run-through manner; a first electromagnet isfixedly connected with the inner side wall of the mounting box; transformer oil in the heat dissipation groove absorbs heat; the first electromagnet and a second electromagnet are electrified to pusha rack to move rightwards; a heat dissipation plate on the left side transfers heat to the exterior while a fan is driven to rotate; when an L-shaped plate moves rightwards to prop against a baffle, the first electromagnet and the second electromagnet are power down, and the high-temperature transformer oil is in contact with a right side heat dissipation plate to drive the fan to rotate reverselyto blow air to the heat dissipation sheet; and equipment temperature is lowered by virtue of the above steps repeatedly. By virtue of the inversion structure, heat generated by the components can betaken away quickly, a high heat dissipation effect is achieved, excellent performance of the equipment is ensured, and the service life of the equipment is prolonged.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to an LED filament light source flip-chip structure. Background technique [0002] Flip-chip structure LED, because it can be integrated and mass-produced, the preparation process is simple, and its performance is excellent, has gradually received extensive attention from the lighting industry. The flip-chip structure adopts the eutectic bonding of the chip PN junction directly with the positive and negative electrodes on the substrate, without using gold wires, and avoiding the problem of photoquenching to the greatest extent. Under the existing technology, the heat dissipation effect of the ordinary flip-chip structure LED is not good, and the high temperature may easily cause the aging of the components, affecting the performance and service life. Contents of the invention [0003] The object of the present invention is to propose an LED filament light source flip-chip s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/64H05K7/20H01R13/703
CPCH01L33/64H01R13/7036H05K7/2039
Inventor 王幼建
Owner 常德非凡照明电器有限公司
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