Slicing machine for improving slicing quality of diamond wire

Abstract

The invention relates to a slicing machine for improving the slicing quality of a diamond wire. The slicing machine comprises a base and a workbench, the workbench is provided with two parallel guidewheels and a fragment box, and the diamond wire is wound around the guide wheels. The slicing machine is characterized by further comprising an air compression device, an air compression pipeline is additionally arranged near a slicing machine net, air is evenly blown towards the diamond wire during cutting so as to remove cutting micro-powder adhering to the diamond wire in time, and the situation that the micro-powder covers the diamond wire to affect cutting is prevented. By application of the slicing machine, the diamond wire cutting force can be continuously stable, and under the condition that the same materials are cut, saw marks andthe breaking ratio are obviously reduced, the cutting time is shortened by about one hour, and the rate of A-grade products can be increased by about 5%.

Description

technical field [0001] The invention relates to the field of ceramic cutting, in particular to a slicer for improving diamond wire slice quality. Background technique [0002] Photovoltaic power generation is a renewable and clean energy source, and silicon wafers are an important part of photovoltaic solar cells. At present, silicon wafers are mostly prepared by cutting crystalline silicon rods into required silicon wafers by a multi-wire cutting method. Cutting methods include mortar cutting and diamond wire cutting. Compared with traditional mortar cutting, diamond wire cutting monocrystalline silicon, polysilicon or sapphire has certain advantages in the industry. Cutting thinner silicon wafers also has the advantages of cost reduction and environmental pollution reduction. However, there is still an obvious defect in the slicer at present, that is, the dispersibility of the cutting fluid is limited during diamond wire cutting, and part of the silicon powder remains in ...

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the deficiencies in the prior art, the present invention adds a compressed air device under the diamond wire cutting fragment box, and the air is evenly blown on the cutting diamond wire wire net, which can effectively solve the problem of remaining fine powder of the diamond wire during cutting , so that the diamond wire cutting force is continuously maintained, the technical solution adopted by the present invention is as follows:

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