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A superfine high-strength alloy tungsten wire diamond wire saw and its preparation method

A technology of diamond wire saw and diamond particles, which is applied in the direction of metal sawing equipment, metal processing equipment, sawing machine tool manufacturing, etc., which can solve the problem that the surface cleanliness of tungsten wire cannot be guaranteed, the production speed of diamond wire cannot be matched, and the oxidation It is difficult to remove residues and other problems, and achieve the effect of improving deposition depth capability, high torsion value and low resistivity

Active Publication Date: 2022-03-08
江苏聚成金刚石科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the conventional method of removing thick oxide layer and graphite milk cannot match the production speed of diamond wire. At the same time, the removal rate is low, and the surface cleanliness of tungsten wire cannot be guaranteed. For example, it is difficult to remove graphite milk and oxide residues in the drawing groove. , these technical problems have increased the complexity of applying tungsten wire to the wire saw preparation process

Method used

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  • A superfine high-strength alloy tungsten wire diamond wire saw and its preparation method
  • A superfine high-strength alloy tungsten wire diamond wire saw and its preparation method
  • A superfine high-strength alloy tungsten wire diamond wire saw and its preparation method

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Embodiment 1

[0048] In this embodiment, black tungsten wire having a diameter of 45 μm is used as a bus bar to prepare an ultrafine high strength alloy tungsten diamond line saw, such as Figure 1-3 As shown, the preparation process of the present invention includes the following steps:

[0049] Step 1, black tungsten wire is released → three-stage electrolysis polishing → water washing → dry → collect line, prepare white tungsten wire;

[0050] Step 2, the white tungsten wire obtained after one proceeds, sequentially passed, secondary eloquent oil → water washing → pickled → water washing → shock nickel → super sand → Sand → Wash → heat treatment → Take line, obtained Target product.

[0051] The three-stage electrolysis polishing process in steps include:

[0052] (1) The first-stage electrolysis polishing process parameters include: 170 g / l NaOH, 40g / L K2CO3, the electrolysis polishing temperature is 20 ° C, the polishing liquid is 200 l / min, the current density is 9A / DM 2 The drying...

Embodiment 2

[0064] In this embodiment, black tungsten wire having a diameter of 42 μm is used as a busbar preparation specification as a superfine high intensity alloy tungsten diamond line saw such as Figure 1-3 As shown, the preparation process of the present invention includes the following steps:

[0065] Step 1, black tungsten wire is released → three-stage electrolysis polishing → water washing → dry → collect line, prepare white tungsten wire;

[0066] Step 2, after the step (1) is processed, the white tungsten wire is processed, and the secondary removal → secondary removal → water washing → pickled → Wash → shock nickel → super sand → Sand → Wash → heat treatment → Take line, obtained Target product.

[0067] The three-stage electrolysis polishing process in steps include:

[0068] (1) The first-stage electrolysis polishing process parameters include: 170 g / l NaOH, 40g / L K2CO3, the electrolysis polishing temperature is 20 ° C, the polishing liquid is 200 l / min, the current dens...

Embodiment 3

[0080] In this embodiment, alloy tungsten wire having a diameter of 39 μm is used as a super fine high strength alloy tungsten diamond line saw of the bus bar. Figure 1-3 As shown, the preparation process of the present invention includes the following steps:

[0081] Step 1, black tungsten wire is released → three-stage electrolysis polishing → water washing → dry → collect line, prepare white tungsten wire;

[0082] Step 2, after the step (1) is processed, the white tungsten wire is processed, and the secondary removal → secondary removal → water washing → pickled → Wash → shock nickel → super sand → Sand → Wash → heat treatment → Take line, obtained Target product.

[0083] Step, three-stage electrolysis polishing process, including:

[0084] (1) The first-stage electrolysis polishing process parameters include: 170 g / l NaOH, 40g / L K2 CO3, the electrolysis polishing temperature is 20 ° C, the polishing liquid is 200 l / min, the current density is 9A / DM 2 The drying tempe...

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Abstract

The patent of the invention discloses a preparation technology of an ultra-fine high-strength alloy tungsten wire diamond wire saw, which belongs to the field of solar photovoltaic slice wire saws, and mainly relates to a preparation method of single crystal and polycrystalline rod cutting wire saws. The preparation method of the present invention comprises the following steps: (1) preferred black tungsten wire, which undergoes setting-off→three-stage electrolytic polishing→water washing→drying→winding to prepare silver-white metallic luster tungsten wire; (2) The tungsten wire treated in step (1) is followed by setting off→secondary degreasing→pickling→nickel impact→sanding→sand fixing→heat treatment→wire take-up. After the above steps, alloy tungsten wire diamond wires with specifications of 30-40um are prepared. saw. By optimizing the process parameters of combined control steps (1) and (2), a high-strength ultra-fine tungsten alloy diamond wire saw is prepared, which can reduce the silicon material loss by about 13% when cutting large-size single crystal silicon rods. It can produce an extra value of 288-300 yuan, and each piece can increase the income of 0.11-0.15 yuan, which has great economic and promotional value.

Description

Technical field [0001] The present invention belongs to the field of photovoltaic slice wire saw, and more particularly to a superfine high intensity alloy tungsten diamond line saw and a preparation method thereof. Background technique [0002] Since the photovoltaic slices producers have more aggressive on the surface of the sliced, the process is broken, the single-knife consumption is more aggressive. In addition to the above indicators, the customer requires to increase the single-knife code rate to reduce production costs. At the same time, the silicon sizes are gradually turned from 158 μm to 210 μm, or even larger sizes. At present, the Damang line saw field is basically using 92C or 100C wire as a carrier, preparing different specifications diamond line saws, usually carbon steel bus lines should pass through the large pull → 中 拉 → heat treatment → ISC → multi-pass pull. Based on the above process, the busbar can easily diffuse the zinc copper coating, tissue inclusion, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23D61/18B23D65/00C25D7/06C25D5/38C25F3/26C25F3/08C25F7/00C25F1/08C25D3/12C25D15/00
CPCB23D61/185B23D65/00C25D7/0607C25D5/38C25F3/26C25F3/08C25F7/00C25F1/08C25D3/12C25D15/00
Inventor 韩登峰李信张福军
Owner 江苏聚成金刚石科技股份有限公司