A nanometer metal substrate, a preparation method thereof, and a preparation method of a circuit board containing the substrate

Abstract

The invention discloses a nanometer metal substrate, a preparation method thereof and a preparation method of a circuit board containing the substrate. The substrate comprises a low thermal expansioncoefficient polyimide layer, a coarse polyimide layer and an ultra-thin nanometer metal layer. The ultrathin nanometer metal layer comprises a silver metal layer, a copper metal layer and a nickel metal layer; The thickness of ultrathin nanometer metal layer is 90-800 nm, wherein the thickness of the silver metal layer is 5-15nm, the thickness of copper layer is 90-150nm, the thickness of nickel metal layer is 5-15nm. As that nano cop design is adopted, the invention can meet the requirement of the fine line development of the substrate, meet the production requirements of the FPC manufacturer, reduce the product yield of the FPC manufacturer and reduce the process cost; Moreover, the physical preparation method of nanometer metal substrate can improve the abnormalities such as hole breakage and pit caused by too much biting on the hole wall of metal substrate by chemical method, especially the abnormalities such as carbon residue caused by black hole copper plating, which leads to theabnormalities such as reliability, size and peeling strength, etc., and has the advantages of reducing FPC drilling process and shortening the manufacturing cycle.

Description

technical field [0001] The invention belongs to the technical field of electronic substrates, and in particular relates to a nanometer metal substrate, a preparation method thereof, and a preparation method of a circuit board containing the substrate. Background technique [0002] With the rapid development of the IT industry, electronic products are becoming thinner, lighter and shorter, and printed circuit boards are also facing the challenges of high precision, high density, and thin lines. Especially in recent years with the rapid development of 4G, 5G, 6G...and 2K, 4K and other display screens, the drive flexible circuit board must become smaller and smaller and can integrate some passive components on the circuit board, not only It is beneficial to the miniaturization of the system, improves the assembly density of the circuit, and is also conducive to improving the reliability of the system. In view of this, it is urgent to develop a material for thin high-density ci...

AI Technical Summary

Problems solved by technology

However, this process is prone to abnormalities such as hole breaks and pits caused by excessive corrosion of through holes during chemical roughening, especially copper plating with black holes is prone to carbon residues, resulting in abnormalities in reliability, size, and peel strength.

In order to meet the requirements of the bonding force, heat treatment is required to improve the bonding force between the conventional metal layer and the polyimide layer after the completion of the first catalyst layer, but this brings great problems to the dimensional stability of the substrate. troubled

[0007] In the carrier copper method, although the carrier layer protects the copper foil from being broken or scratched, it is easy to cause processing difficulties and residual stress during peeling off the carrier layer, which may easily cause deformation of the copper foil and increase in size expansion and contraction; Ultra-thin copper foil is not easy to process, which will increase the processing cost

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