Nano metal substrate and manufacturing method for ultra-fine circuit fpc and cof materials

Abstract

The invention discloses a nano-metal substrate for an ultrafine line FPC (Flexible Printed Circuit) and COF (Chip On Film) material and a manufacturing method. The nano-metal substrate comprises a polyimide layer with a low thermal expansion coefficient, a roughened polyimide layer formed on at least one side of the polyimide layer with a low thermal expansion coefficient, an ultra-thin nano-metallayer and a protective film layer formed on the other side of the roughened polyimide layer; the roughened polyimide layer is arranged between the polyimide layer with a low thermal expansion coefficient and the ultra-thin nano-metal layer; and the ultra-thin nano-metal layer is arranged between the roughened polyimide layer and the protective film layer. The nano-metal substrate is excellent inion migration resistance, dimensional stability, chemical resistance, heat resistance, high-temperature resistance and adhesion, suitable for laser processing blind holes / micropores, not easy to generate pinholes, suitable for fine line etching, and not easy to be etched. The invention adopts nano-copper design to meet the needs of thinning development of substrates.

Description

technical field [0001] The invention belongs to the technical field of electronic substrates, in particular to a nanometer metal substrate used for ultra-fine line FPC and COF materials. Background technique [0002] FPC (Flexible Printed Circuit), commonly known as "soft board", has the advantages of lightness, thinness, shortness, and smallness. It is widely used in small electronic products such as mobile phones, digital cameras, and digital cameras. COF ( ChipOn Film (chip-on-film packaging) technology is a technology that uses a flexible circuit board as a package chip carrier to combine the chip with the flexible circuit board circuit. As electronic products tend to be miniaturized, FPC or COF flexible circuit boards are required to be more powerful in function and tend to develop in the direction of high frequency, high density and thin lines. [0003] Flexible copper-clad laminates are substrate materials processed by FPC or COF, and the high-density and thin-line p...

AI Technical Summary

Problems solved by technology

[0007] The technical problem mainly solved by the present invention is to provide a nano-metal substrate and a manufacturing method for ultra-fine line FPC and COF materials, which have excellent ion migration resistance, dimensional stability, chemical resistance, heat resistance and high temperature resistance It is suitable for laser processing, suitable for laser processing of blind holes / micro holes, and is not easy to produce pinholes, suitable for thin line etching, and not easy to side etch; the invention adopts nano-copper design to meet the needs of the development of thin line substrates

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