Nano metal substrate for ultra-fine line FPC and COP material, and producing method

Abstract

The invention discloses a nano metal substrate for ultra-fine line FPC and COP material, comprising a first low adhesion layer, a polyimide layer formed on at least one face of the first low adhesionlayer, and an ultra-thin nano metal layer and a protection film layer, which are formed on the other face of the polyimide layer. The ultra-thin nano metal layer is disposed between the polyimide layer and the protection film layer. The thickness of the first low adhesion layer is 3-25 [mu]m; the thickness of the polyimide layer is 5-50 [mu]m; the thickness of the ultra-thin nano metal layer is 0.09-0.8 [mu]m; the thickness of the protection film layer is 6-60 [mu]m; the surface roughness of the polyimide layer is 80-800nm; the ultra-thin nano metal layer is a sputtering layer or an electro-plated layer. The invention is advantageous in that ion migration resistance, size stability, chemical proofing, heat and high temperature resistance, and adhesive power are good; the nano metal substrate is suitable for laser processing, and suitable for processing blind holes / micro holes without easily generating needle holes, and is also suitable for etching of fine lines without side etching; the design of nano copper is adopted, and the demand of substrate fine line development can be met.

Description

technical field [0001] The invention belongs to the technical field of electronic base materials, in particular to a nanometer metal base material used for ultra-thin circuit FPC and COF materials. Background technique [0002] FPC (Flexible Printed Circuit), commonly known as "soft board", has the advantages of lightness, thinness, shortness, and smallness. It is widely used in small electronic products such as mobile phones, digital cameras, and digital cameras. COF ( ChipOn Film (chip-on-film packaging) technology is a technology that uses a flexible circuit board as a package chip carrier to combine the chip with the flexible circuit board circuit. As electronic products tend to be miniaturized, FPC or COF flexible circuit boards are required to be more powerful in function and tend to develop in the direction of high frequency, high density and thin lines. [0003] Flexible copper-clad laminates are substrate materials processed by FPC or COF, and the high-density and ...

AI Technical Summary

Problems solved by technology

[0007] The technical problem mainly solved by the present invention is to provide a nano-metal base material for ultra-fine line FPC and COF materials, which has excellent ion migration resistance, dimensional stability, chemical resistance, heat resistance and high temperature resistance and Adhesive force; suitable for laser processing, suitable for laser processing of blind holes / micro holes, and not easy to produce pinholes, suitable for thin line etching, not easy to side etch; the invention adopts nano-copper design to meet the needs of the development of thin line substrates

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