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Display substrate, preparation method thereof, and display device

A display substrate and substrate substrate technology, applied in semiconductor/solid-state device manufacturing, organic semiconductor devices, semiconductor devices, etc., can solve the damage of the light-emitting layer of OLED devices, the increase of OLED display device box thickness, and unsuitable mass production methods and other problems to achieve the effect of preventing damage and avoiding the increase of box thickness

Active Publication Date: 2022-07-12
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this photolithography technology requires a complex process, involving multiple masks and exposure processes, and because it requires high temperature, photoresist scouring and other process characteristics, it will cause damage to the light-emitting layer of OLED devices, and is not suitable for mass production. means
Another way to improve the conductivity of the top electrode is to make auxiliary electrodes on the package cover. Using this method can avoid the problems in the above-mentioned manufacturing process, but because the auxiliary electrodes rely on the package cover, it will lead to final molding. The thickness of the OLED display device box increases, which is not conducive to the thinning and thinning of the OLED display device

Method used

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  • Display substrate, preparation method thereof, and display device
  • Display substrate, preparation method thereof, and display device
  • Display substrate, preparation method thereof, and display device

Examples

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preparation example Construction

[0041] figure 2 A flowchart of a method for preparing a display substrate provided in Embodiment 2 of the present invention, as shown in figure 2 As shown, the preparation method can prepare the display substrate in the above-mentioned first embodiment, including:

[0042] Step S101 , forming a pixel defining layer and a plurality of organic light emitting diodes on a base substrate.

[0043] Step S102, forming a plurality of conductive patterns on the side of the top electrode of the organic light emitting diode facing away from the base substrate, the orthographic projection of the conductive pattern on the plane where the pixel definition layer is located is located in the area where the pixel definition layer is set and is located with the top electrode. Partial connections on the pixel-defining layer.

[0044] Step S103 , forming a planarization layer on the side of the top electrode facing away from the base substrate.

[0045] Step S104, an auxiliary electrode is for...

Embodiment approach

[0047] image 3 A flowchart of a method for preparing a display substrate provided in Embodiment 3 of the present invention, Figure 4a ~ Figure 4f to adopt image 3 The cross-sectional schematic diagram of the intermediate structure of the display substrate prepared by the shown preparation method, such as Figures 3 to 4f As shown, the preparation method is a more specific preferred embodiment based on the preparation method provided in Example 2, including:

[0048] Step S201 , forming a pixel defining layer and a plurality of organic light emitting diodes on a base substrate.

[0049] see Figure 4a As shown, the process of forming the pixel defining layer 2 and the OLED on the base substrate 1 in step S201 may adopt the existing process, and the specific process will not be described in detail here. Among them, the OLED includes a bottom electrode (not shown), a light-emitting layer 3 and a top electrode 4 .

[0050] Step S202 , forming a plurality of conductive patt...

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Abstract

The invention discloses a display substrate, a preparation method thereof and a display device, comprising: a base substrate, a pixel defining layer and an organic light emitting diode are arranged on the base substrate, and the top electrode of the organic light emitting diode faces away from the side of the base substrate A conductive pattern is provided, the orthographic projection of the conductive pattern on the plane where the pixel defining layer is located is located in the area where the pixel defining layer is arranged and is connected to the part of the top electrode located on the pixel defining layer, and the top electrode is arranged on the side facing away from the base substrate There is a flattening layer, and the side of the flattening layer facing away from the base substrate is provided with an auxiliary electrode, and the auxiliary electrode is connected with the conductive pattern. In the present invention, the formation of the auxiliary electrode does not need to rely on the encapsulation cover plate, which can effectively avoid the increase of the thickness of the OLED display device, which is beneficial to the thinning of the OLED display device; in addition, the transfer process can be used to form the auxiliary electrode in the present invention. At this time, since the planarization layer has been filled in the pixel area, the auxiliary electrode can be prevented from being damaged during the transfer process.

Description

technical field [0001] The present invention relates to the field of display technology, and in particular, to a display substrate, a preparation method thereof, and a display device. Background technique [0002] Organic Light-Emitting Diode (OLED) panels are a display lighting technology that has gradually developed in recent years, especially in the display industry. application prospects. Among them, the top-emission OLED structure has become the main research direction due to its advantages of higher aperture ratio and optimization of light extraction by utilizing the microcavity effect. [0003] For the top-emitting OLED structure, the top electrode (the cathode of the OLED) as the light-emitting surface of the OLED must have good light transmittance. At present, the top electrode of the top emission OLED structure is mostly thin metal or transparent conductive material (such as ITO, IZO). The metal material has poor transmittance, and it is easy to increase the resi...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L51/52H01L51/56
CPCH10K59/122H10K2102/3026H10K59/80522H10K59/173H10K59/1795H10K59/1315H10K50/824H10K59/131H10K71/00
Inventor 罗程远
Owner BOE TECH GRP CO LTD