Semiconductor cold and hot oven

Abstract

The invention relates to a semiconductor cold and hot oven. The oven structurally comprises a pot body, a semiconductor chilling plate, an oven rack, a thermal insulation filling layer, a thermal insulation outer cover, an inner layer heat dissipation water pipe, an outer layer heat dissipation water pipe, a power controller, a first temperature sensor and a second temperature sensor. The high heating efficiency characteristic of the semiconductor chilling plate is applied to manufacturing an efficient cooking pot which can replace a conventional civil gas stove, an electric cooker, an electromagnetic range, a microwave oven and other cooking heating devices, and the oven has the advantages of being clean and sanitary and facilitating environmental protection and is suitable for being applied and popularized. The semiconductor cold and hot oven has the multiple purposes of refrigerating and heating, and has the remarkable energy-saving effect, thermal loss is quite low, the heating speed is high, electric energy can be saved by 50% or more compared with the electromagnetic range, and electric energy can be saved by 55% or more compared with the electric cooker.

Description

technical field [0001] The invention relates to a civilian cooker, in particular to a semiconductor hot and cold cooker. Background technique [0002] The semiconductor refrigeration technology has gradually matured. It mainly uses the Peltier refrigeration principle of the semiconductor refrigeration sheet (bismuth telluride), that is, heat transfer occurs after power is applied, and cooling and heating can be realized at the same time. If a cold source and a heat source are provided on the two ends of the semiconductor refrigeration sheet, when the two ends reach a certain temperature difference, power generation can be generated (called "thermoelectric power generation"). Therefore, this semiconductor material is generally used for thermoelectric power generation in ocean areas. . [0003] At present, semiconductor refrigeration chips have been widely used in refrigerators, air conditioners, water dispensers and constant temperature control, and are favored by the indust...

AI Technical Summary

Problems solved by technology

Its shortcomings are, first, due to the limitations of the cooling method, it is difficult to break through the cooling temperature below 0°C. Even if the best water circulation cooling method is used, it will be difficult to produce a temperature below 0°C due to the gradual increase of the water temperature.

Second, due to the limitation of temperature difference, it is difficult for heating applications to achieve continuous and efficient heating

However, this high heating efficiency will be greatly reduced in practical applications due to the limitation of temperature difference, thus limiting the generation of higher temperatures above 100°C

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