Unlock instant, AI-driven research and patent intelligence for your innovation.

SPICE (Simulation Program with Integrated Circuit Emphasis) model parameter acquiring method and SPICE model parameter acquiring device

A technology of model parameters and acquisition methods, which is applied in the fields of electrical digital data processing, CAD circuit design, special data processing applications, etc., can solve the problem of low reliability of simulation test results, and achieve the effect of improving reliability and efficiency

Pending Publication Date: 2018-08-21
YANGTZE MEMORY TECH CO LTD
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a SPICE model parameter acquisition method and a SPICE model parameter acquisition device, which are used to solve the problem of low reliability of the simulation test results of the existing interconnection structure circuit, thereby improving the efficiency of the interconnection structure circuit design

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • SPICE (Simulation Program with Integrated Circuit Emphasis) model parameter acquiring method and SPICE model parameter acquiring device
  • SPICE (Simulation Program with Integrated Circuit Emphasis) model parameter acquiring method and SPICE model parameter acquiring device
  • SPICE (Simulation Program with Integrated Circuit Emphasis) model parameter acquiring method and SPICE model parameter acquiring device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0044] In order to input the parasitic capacitance factor as a parameter into the SPICE model for simulation testing, there are mainly two ways to realize it at present: Poisson equation solution and manual solution. Although the result of the parasitic capacitance solved by the Poisson equation is accurate, the calculation process is complex and requires a large memory space, and the result obtained is not an analytical solution, which cannot be directly applied to the circuit design test of the SPICE model. Manual solution refers to the manual calculation using the plate capacitance formula according to the estimated parasitic effect, and the calculation result is input into the SPICE model as a parameter. However, due to the limitation of human factors, the manual calculation method often only considers the factors that have the greatest impact on parasitic capacitance, and the reliability of the calculation results is low; at the same time, the manual calculation method can...

no. 2 Embodiment approach

[0080] This specific embodiment provides a SPICE model parameter acquisition method and a SPICE model parameter acquisition device. attached Figure 4 is a schematic structural diagram of the SPICE model in the second specific embodiment of the present invention. The same parts as those in the first specific embodiment will not be described again, and the differences from the first specific embodiment will be mainly described below.

[0081] Such as Figure 4 As shown, the interconnect structure model constructed in this specific embodiment includes a first layer 40, a second layer 43 stacked below the first layer 40, and a third layer 44 stacked above the first layer 40; Described SPICE model establishment method also comprises the steps:

[0082] Calculate the inter-line coupling capacitance C of multiple layers corresponding to multiple simulation parameters one-to-one c and multiple total coupling capacitors C d , the interlayer interline coupling capacitance C c Inc...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an SPICE (Simulation Program with Integrated Circuit Emphasis) model parameter acquiring method and an SPICE model parameter acquiring device. The SPICE model parameter acquiring method comprises the following steps: establishing an interconnection structure model; setting multiple simulation parameters related to target signal line coupling capacitance; calculating a plurality pieces of in-layer line coupling capacitance and a plurality pieces of total coupling capacitance in one to one correspondence to the multiple simulation parameters; by taking the simulation parameters of independent variables and the in-layer line coupling capacitance and the total coupling capacitance as dependent variables, performing equation fitting so as to obtain fitting equations; according to the fitting equations, calculating in-layer line coupling capacitance and total coupling capacitance of a preset signal line, and inputting the parameters into an SPICE model. By adopting themethod and the device, the reliability of a circuit simulation testing result can be improved, and the interconnection structured circuit design efficiency can be improved.

Description

technical field [0001] The invention relates to the technical field of circuit simulation, in particular to a SPICE model parameter acquisition method and a SPICE model parameter acquisition device. Background technique [0002] As technology develops, the semiconductor industry is constantly seeking new ways to produce a greater number of memory cells per memory die in a memory device. In non-volatile memory, such as NAND memory, one way to increase the memory density is by using vertical memory arrays, that is, 3D NAND (three-dimensional NAND) memory; 32 layers developed to 64 layers, or even higher layers. [0003] The three-dimensional memory includes a stack structure and an interconnection structure above the stack structure, and the interconnection structure is used to transmit control signals to the stack structure. Generally speaking, before performing the design of the interconnection structure, it is necessary to carry out simulation design on the circuit of the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F17/50
CPCG06F30/30G06F30/20
Inventor 李雪钟灿江勤
Owner YANGTZE MEMORY TECH CO LTD