ACF automatic attachment device

Abstract

The invention relates to the field of LCM liquid crystal module production technology, specifically an ACF automatic attaching device, which includes a fixed plate, a vertical plate and a back plate, and is characterized in that it also includes a digital display panel, an ACF fixed wheel, and a waste recycling port , vacuum suction device, material detection optical fiber, photoelectric controller, X, Y servo mechanism, pressure head mechanism, ACF attachment length detection mechanism, ACF material belt automatic layering mechanism, ACF automatic length fixing mechanism and ACF automatic cutting mechanism The ACF fixing wheel is arranged on the upper left part of the backboard to fix the ACF tray; the waste recovery port is arranged on the lower right part of the backboard to absorb the base tape of the cut ACF tape; the vacuum suction The material device is arranged at the position corresponding to the waste recycling port on the back of the backboard; the material detection optical fiber is installed on the material detection optical fiber support seat of the backboard, and placed under the ACF fixed wheel; the photoelectric controller is arranged at The back panel is used to control the material detection fiber, length detection fiber and travel sensor.

Description

technical field [0001] The invention relates to the field of LCM liquid crystal module production technology, in particular to an ACF automatic attaching device. Background technique [0002] In the production process of LCM liquid crystal modules, ACF glue (anisotropic conductive glue) needs to be used for bonding in the ACF attachment process. The modified glue has the functions of unidirectional conduction and gluing and fixing. The attachment process of ACF glue involves the movement of the ACF tray, the precision of fixed length, the alignment of the X and Y axes of the liquid crystal glass and the control of related temperatures. [0003] In the prior art, the ACF adhesive cannot measure the length of the adhesive tape, and cannot provide guarantee for the lamination accuracy of the rear FPC, and greatly increases the defect rate of the client product, which increases the manufacturing cost of the client. In the lamination process, there are many inconveniences in adj...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the ACF adhesive cannot measure the length of the adhesive tape, and cannot provide guarantee for the bonding accuracy of the rear FPC, and greatly increases the defect rate of the client product, which increases the manufacturing cost of the client.

In the lamination process, there are many inconveniences in adjusting the horizontal accuracy of the indenter. The level of the indenter will also affect the quality of ACF attachment, and the temperature control of the indenter and the platform will also affect the quality of the attachment. Among them, the temperature value and Uniformity of temperature is an important factor

The recovery of the waste separation layer is entirely manual, and there are great hidden dangers in operation and safety, which does not meet the needs of modern automated production

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