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Testing probe card for integrated circuit

A technology for testing probes and integrated circuits, applied in the field of testing probe cards, which can solve problems such as long production time, difficult probe welding construction, and difficult maintenance

Inactive Publication Date: 2018-08-28
CHUNGHWA PRECISION TEST TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, each probe is made by manual welding, and because the size of the chip under test is shrinking, the spacing between the pins is also shrinking. Relatively, the spacing between the probes must be reduced, so the soldering construction of the probes is more difficult. Because it is not easy, it takes longer to make
In addition, when the horizontal probe card is used for a period of time, the probes are worn out and must be repaired or replaced, and the probes that are too closely spaced are not easy to repair

Method used

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  • Testing probe card for integrated circuit
  • Testing probe card for integrated circuit
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Embodiment Construction

[0031] Referring to the drawings, where the same reference numerals represent the same components or similar components, the principles of the present invention are exemplified when implemented in a suitable computing environment. The following description is based on illustrated specific embodiments of the invention, which should not be construed as limiting other specific embodiments of the invention not described in detail herein.

[0032] refer to figure 2 and Figure 3, figure 2 A schematic diagram showing a test probe card of an integrated circuit in an embodiment of the present invention, Figure 3A A schematic diagram of the fan-out structure of the test probe card in the embodiment of the present invention is shown. The integrated circuit is, for example, a chip 208 with test points 210 . The integrated circuit test probe card includes a probe base 200 , a fan-out structure 202 , a circuit board 220 and a probe base fixing mechanism 216 . The probe base 200 on th...

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Abstract

The invention relates to a test probe card for an integrated circuit, which is formed by a probe holder and a fan out structure connected to form a new type of probe card structure (modifying cantilever probe card, MCPC) so as to shorten the production time of an existing horizontal Cantilever Probe Card (CPC); the probe card can be easily repaired so as to improve the efficiency of the test. Theprobe card of the present invention can also be adapted for high frequency / high speed applications by designing an application circuit and / or impedance control in a transmission path of the probe signals. Moreover, since the probe of the probe card of the present invention faces the test point of the chip in the vertical direction, lateral scratches can be avoided, which contributes to the improvement of the yield of the post-packaging operation.

Description

【Technical field】 [0001] The invention relates to a test probe card, in particular to a test probe card for an integrated circuit. 【Background technique】 [0002] With the development of electronic products towards precision and multi-function, the chip structure of the integrated circuit in the electronic product tends to be complex, and the operating frequency of the chip structure is also greatly increased, so as to be used in the field of electronic products with higher frequency bands . For example is figure 1 The probe card structure of the integrated circuit shown is generally called a horizontal probe card (or called cantileverprobe card), including a printed circuit board 10, a fixing ring 12 arranged on the printed circuit board, and solder 20 welding A plurality of probes 14 are arranged on the fixed ring 12 of the printed circuit board 10, and the horizontal probe card passes through the contact pads 18 of the chip (not shown) on the wafer 16 to electrically co...

Claims

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Application Information

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IPC IPC(8): G01R1/073
CPCG01R1/073
Inventor 李文聪林承锐谢开杰
Owner CHUNGHWA PRECISION TEST TECH
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