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Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same

An ultrasonic transducer, transducer technology, applied in welding equipment, welding equipment, non-electric welding equipment and other directions

Active Publication Date: 2018-08-28
KULICKE & SOFFA IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, high impedance may be caused in the second mode of operation, which in turn causes various field problems (e.g. ultrasonic tuning failure)

Method used

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  • Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
  • Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
  • Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same

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Embodiment Construction

[0033] As used herein, the term "semiconductor element" is intended to refer to any structure that includes (or is configured to include in a subsequent step) a semiconductor chip or wafer. Exemplary semiconductor components include semiconductor dies, semiconductor wafers on substrates / workpieces (e.g., leadframes, PCBs, standoffs, etc.), packaged semiconductor devices, flip-chip semiconductor devices, wafers embedded in substrates, stacks of semiconductor wafers , and so on. Additionally, semiconductor components may include components configured to be bonded or otherwise included in a semiconductor package (eg, a submount, a substrate, etc. to be bonded in a stacked wafer configuration).

[0034] According to various exemplary embodiments of the present invention, one or more mechanical resonators tuned to the operating frequency of the ultrasonic transducer are used as vibration absorbers to provide dynamic isolation of the ultrasonic transducer installation. That is, acc...

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PUM

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Abstract

An ultrasonic transducer system is provided. The ultrasonic transducer system includes: a transducer mounting structure; a transducer, including at least one mounting flange for coupling the transducer to the transducer mounting structure; and a tuned resonator having a desired resonant frequency, the tuned resonator being integrated with at least one of the transducer mounting structure and the at least one mounting flange.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of U.S. Provisional Application No. 62 / 460,793, filed February 18, 2017, the contents of which are incorporated herein by reference. technical field [0003] The present invention relates to ultrasonic transducer systems, and more particularly to improved ultrasonic transducer systems including tuned resonators, as well as devices including such ultrasonic transducer systems and methods of using such systems. Background technique [0004] Ultrasonic transducers are used in a variety of applications. For example, such ultrasonic transducers are widely used in semiconductor packaging equipment, such as automatic wire bonding machines (for example, ball bonding wire bonding machines, flat bonding wire bonding machines, strip bonding wire bonding machines, etc.) and new generation packaging machines (For example, a flip-chip bonder such as a thermocompression bonder, etc.). [0005] An...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67B23K20/10
CPCB06B1/06B06B1/00H01L24/78H01L2224/78301H01L2224/78349H01L2224/78925B23K2101/40B06B1/0292H01L21/67121B23K20/10B23K1/06B23K1/0016H01L24/75H01L2224/75349B23K20/106
Inventor D·A·迪安杰利斯
Owner KULICKE & SOFFA IND INC