Semiconductor structure and method of forming the same

Abstract

The invention provides a semiconductor structure and a method of forming the same. When the semiconductor structure is heated or exposed to light, bending of a flexible substrate is promoted by an ester material layer and carbon nano tubes because the thermal expansion coefficient of the ester material layer is larger than that of the flexible substrate. Furthermore, the gaps between the flexiblesubstrate and the carbon nano tubes and gaps between the carbon nano tubes are filled with the ester material layer, so that the spaces between the carbon nano tubes are increased by the ester material layer. The carbon nano tubes can constrain the expansion of the ester material layer, so that the semiconductor structure is bent; and when not being heated or exposed to light, the semiconductor structure becomes flat again. The semiconductor structure having advantages of small size, simple structure, and great convenience in controlling can be applied to various devices like a switch or a sensor.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a semiconductor structure and a forming method thereof. Background technique [0002] In recent years, flexible, bendable and lightweight electronic devices and devices have received widespread attention. However, most of the devices used in these flexible electronic devices are traditional bulk hard devices, and the preparation steps are complicated. The flexibility of electronic devices is limited, thereby limiting its development in wearable electronics and related fields. Therefore, the prior art still needs to be improved and developed. Contents of the invention [0003] The object of the present invention is to provide a semiconductor structure and a forming method thereof, so as to improve the performance of existing flexible electronic devices. [0004] In order to achieve the above object, the present invention provides a semiconductor structure, which comp...

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Problems solved by technology

[0002] In recent years, flexible, bendable and lightweight electronic devices and devices have received widespread attention. However, most of the devices used in these flexible electronic devices are traditional bulk hard devices, and the preparation steps are complicated. Limits the flexibility of electronic devices, thereby limiting their development in wearable electronics and related fields

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