Method for manufacturing multi-layer thick-copper circuit board

Abstract

The invention relates to the technical field of multi-layer circuit board manufacturing, in particular to a method for manufacturing a multi-layer thick-copper circuit board. The method comprises steps of rough shape cutting, browning processing, board layout, and pressing. Organic glass cloth prepregs are combined with non-woven prepregs; and the two surfaces of all thick copper boards face the non-woven prepregs. During the pressing process, solidified liquid of the non-woven prepregs flow into copper-free regions of the corresponding thick copper core boards fully, so that the binding forces of the bases of the bottoms of the copper-free regions and the prepregs are strengthened; adhesive filling is carried out fully; hole occurrence is avoided; and potential safety hazards of layeringand board explosion due to heating are prevented effectively. The organic glass cloth prepregs serve as strength supports between the thick copper core plate and the outer copper foils and the adjacent thick copper core plate are combined, so that problems of board surface recession, wrinkling, and sliding and the like are solved; the laminated multi-layer copper board has the uniform thickness; the appearance quality of the laminated board is improved; and the good foundation is laid for follow-up film pasting, electroplating and SMT assembling.

Description

technical field [0001] The invention belongs to the technical field of multilayer circuit board manufacture, and more specifically relates to a method for manufacturing a multilayer thick copper circuit board. Background technique [0002] Multi-layer circuit board lamination refers to stacking prepreg (PP for short) between any adjacent two-layer circuit boards and combining them together under high temperature and high pressure. In order to meet the needs of power modules, automotive electronics, etc. to carry large current 1. The power supply is stable and needs better heat dissipation products. Therefore, thick copper circuit boards are favored. When thick copper circuit boards are thicker (≥4OZ), there are many difficulties in the lamination process. [0003] Pressing is to use high temperature and high pressure to heat and melt the prepreg, and make the melted liquid glue flow, and then transform into a solidified sheet, so as to bond one or more thick copper core boar...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for making a multi-layer thick copper circuit board to solve the problem of the base material and prepreg at the bottom of the copper-free area of ​​the thick copper core board when the copper thickness of the thick copper core board is greater than or equal to 4OZ in the prior art. Poor binding force, because of poor glue filling, it is easy to produce cavities, and there are hidden dangers of delamination and board explosion after heating in the cavities or poor bonding force, which is not conducive to the technical problems of the reliability of thick copper circuit boards.

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