A liquid-cooled chassis interconnected by three layers of water channels

Abstract

The invention discloses a three-layer-flow channel-interconnected liquid-cooled chassis. The liquid-cooled chassis comprises a main cabinet body, a front cover plate and a rear cover plate, wherein the main box body is made of 5A06 aluminum alloy cold plates; the main box body is a square-box-shaped cabinet body with openings formed at the front and rear, wherein the front opening is connected with the front cover plate, and the rear opening is connected with the rear cover plate, and therefore, a closed hexahedral liquid-cooled chassis can be formed; the main box body is provided with a top plate, a middle plate and a bottom plate; the top plate liquid-cooling flow channel of the top plate, the middle plate liquid-cooling flow channel of the middle plate and the bottom plate liquid-cooling flow channel of the bottom plate are communicated with one another so as to form a liquid-cooling flow channel; and the inner side surface of the rear cover plate is connected with a printed backplane. When the three-layer-flow channel-interconnected liquid-cooled chassis is used, the front cover plate is opened, a plurality of standard electronic modules are sequentially inserted into an upperlayer of sliding slots and a lower layer of sliding slots of the main cabinet body; the standard electronic modules are communicated with the electronic interfaces of the printed backplane, so that achassis-mounted electronic device integrated module can be formed; the front cover plate is assembled; and a peripheral liquid cooling pipeline is in communicated connection with the liquid cooling flow channel, so that the chassis-mounted electronic device integrated module can be cooled. The strength and heat dissipation capability of the liquid-cooled chassis of the invention are improved, manufacturing costs can be decreased, and the application range of the liquid-cooling chassis is extended.

Description

technical field [0001] The invention belongs to the technical field of airborne electronic equipment, in particular, it relates to a liquid-cooled cabinet with three layers of water channels interconnected. Background technique [0002] With the continuous development of airborne electronic equipment in the direction of integration, modularization and integration, higher requirements have been put forward for the carrier chassis as an electronic module. It is extremely sensitive to vibration, so it requires high rigidity and strength of the chassis, and the heat consumption of a single electronic module in the chassis is as high as 100J / s, which requires high heat dissipation performance of the chassis. The cooling flow channels in the chassis are dense and the layout is complex, and three-dimensional flow channel communication between multi-layer cold plates is required, so the flow channel structure and process design of the chassis are difficult. [0003] At present, the...

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems of low splicing strength and unsatisfactory heat dissipation capacity of liquid-cooled runners in traditional liquid-cooled chassis, a liquid-cooled chassis with three-layer water channel interconnection is provided. Layer cavity structure, using 5A06 aluminum alloy combined with bolt connection, mortise joint and welding molding methods, can accommodate the arrangement, electrical interconnection, airtightness, electromagnetic shielding and heat dissipation requirements of more than 20 standard electronic modules with high heat flux

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