Heat radiation and diversion cabinet

A cabinet and diversion area technology, applied in cooling/ventilation/heating renovation, electrical components, electrical equipment structural parts, etc., can solve problems such as affecting the appearance of large equipment, occupying communication equipment cabinet space, and reducing the cooling efficiency of the equipment room. , to achieve the effect of improving user perception, saving power and simple structure
CN108541196AActive Publication Date: 2018-09-14FENGHUO COMM SCI & TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
FENGHUO COMM SCI & TECH CO LTD
Publication Date
2018-09-14

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Abstract

The invention discloses a heat radiation and diversion cabinet comprising a cabinet body which is internally provided with a first air duct and a second air duct. The first air duct comprises a firstair inlet which is arranged on the bottom part of the cabinet body and a first air outlet which is arranged in the middle part of the cabinet body. The second air duct comprises a second air inlet which is arranged in the middle part of the cabinet body and a second air outlet which is arranged on the top part of the cabinet body. The first air outlet and the second air inlet are perpendicular tothe cabinet body panel. The heat radiation and diversion cabinet also comprises a separating plate which is installed between the cabinet body panel and the mainboard. The separating plate is arrangedon the position between the first air outlet and the second air inlet. Cold air intaking and hot air discharging can be independently performed, two sets of air ducts have no mutual interference andthe air temperature superposition effect does not occur so that the heat radiation effect is great; besides, the system flow resistance is low so that the rotating speed of the equipment fan can be reduced, the electric energy consumed for high speed rotation of the fan can be saved, and the comprehensive effect of energy conservation and emission reduction can be achieved.
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Description

technical field

[0001] The invention relates to the field of heat dissipation devices for electronic equipment, in particular to a heat dissipation guide cabinet. Background technique

[0002] At present, for large-scale communication equipment, the power consumption of the motherboard in the cabinet is increasing, and the number of motherboards is also increasing. With the increasing heat flux density of the motherboard of large-scale equipment, the uppermost motherboard is in a high-temperature environment for a long time, and the heat on the motherboard is sensitive. There is a risk of overheating of the device temperature, which will shorten the life of the core device, accelerate aging, and even damage the device and the main board, resulting in the failure of the device or the main board to operate normally.

[0003] For the heat dissipation inside the large-scale communication equipment cabinet, the existing technology usually adopts the following air duct solutions: ...

Claims

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