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Display panel and fabrication method thereof

A technology for a display panel and a manufacturing method, which is used in the manufacture of semiconductor/solid-state devices, organic semiconductor devices, electrical components, etc., can solve the problems of poor stress flexibility, complicated processes, and high price of photomasks, so as to reduce production costs and ensure Flexibility, the effect of simplifying the process

Active Publication Date: 2018-09-18
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the current flexible display technology is not mature enough, and the process is relatively complicated.
In order to improve the stress and flexibility of the flexible AMOLED bending area, the existing flexible AMOLED manufacturing process needs to etch the inorganic film with poor stress and poor flexibility in the bending area, and then fill it with flexible Better PI (polyimide) material
As a result, the manufacturing process of flexible AMOLED requires multiple exposure processes, and each exposure process requires a photomask
However, the price of the photomask is relatively high, and it accounts for a relatively high cost in the production process of flexible AMOLED.

Method used

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  • Display panel and fabrication method thereof
  • Display panel and fabrication method thereof
  • Display panel and fabrication method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] figure 1 is a schematic structural diagram of a display panel according to Embodiment 1 of the present invention.

[0063] refer to figure 1As shown, the first embodiment of the present invention provides a display panel. The display panel includes: a substrate 100 , a buffer layer 110 , a thin film transistor layer 120 , a composite insulating layer 130 and a flat layer 200 . However, it can be understood that the present invention is not limited thereto, and the display panel according to the embodiment of the present invention may also include other necessary components.

[0064] Specifically, the substrate 100 includes a display area 100A and a bending area 100B.

[0065] The buffer layer 110 is disposed on the substrate 100 . The buffer layer 110 includes a first buffer layer 111 located in the display area 100A and a second buffer layer 112 located in the bending area 100B.

Embodiment approach

[0066] The thin film transistor 120 is disposed on the first buffer layer 111 . As an embodiment of the present invention, the thin film transistor 120 includes: an active layer 124, a first insulating layer 121, a gate 125, a second insulating layer 122, a capacitor electrode 126, an interlayer insulating layer 123, a source 127 and a drain Pole 128.

[0067] Specifically, the active layer 124 is disposed on the first buffer layer 111 . The first insulating layer 121 is disposed on the active layer 124 and the first buffer layer 121 , and the first insulating layer 121 extends into the bending region 100B. The gate 125 is disposed on the first insulating layer 121 , and in this embodiment, the gate 125 can also serve as a second capacitor electrode to form a storage capacitor (not shown) with the first capacitor electrode 126 . The second insulating layer 122 is disposed on the gate 125 and the first insulating layer 121 , and the second insulating layer 122 extends into th...

Embodiment 2

[0075] figure 2 is a schematic structural diagram of a display panel according to Embodiment 2 of the present invention.

[0076] refer to figure 2 As shown, the difference between the display panel proposed by the second embodiment of the present invention and the first embodiment is that the via hole 131 in the second embodiment of the present invention includes: a hole that penetrates the interlayer insulating layer 123 and the second insulating layer 122 The first via hole 131 a, and a plurality of second via holes 131 b extending from the bottom of the first via hole 131 a through the first insulating layer 121 and the second buffer layer 112 . As an embodiment of the present invention, one first via hole 131 a and three second via holes 131 b extending from the bottom of the first via hole 131 a through the first insulating layer 121 and the second buffer layer 112 are provided.

[0077] In this embodiment, the wiring 220 is disposed on the first insulating layer 121...

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Abstract

The invention discloses a display panel. The display panel comprises a substrate, a buffer layer, a thin film transistor, an insulation combination layer and a flat layer, wherein the substrate comprises a display region and a bending region, the buffer layer comprises a first buffer layer and a second buffer layer, the first buffer layer is arranged in the display region, the second buffer layeris arranged in the bending region, the thin film transistor is arranged on the first buffer layer, the insulation combination layer is arranged on the second buffer layer, via holes are formed in theinsulation combination layer and the second buffer layer, the flat layer is arranged on a thin film transistor layer and the insulation combination layer, and the via holes are filled with the flat layer. The invention also discloses a fabrication method of the display panel. The via holes are filled with the organic flat layer, the flexibility of the bending region is ensured, meanwhile, the process flow can be simplified, and the production cost is reduced.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to a display panel and a manufacturing method thereof. Background technique [0002] With the performance of optoelectronics and semiconductor technology, it also drives the vigorous development of flat-panel displays. Existing flat panel displays mainly include liquid crystal displays and organic light emitting diode displays (AMOLED). [0003] AMOLED includes rigid AMOLED and flexible AMOLED. The deformable and bendable flexible AMOLED brings subversive experience to users. [0004] However, the current flexible display technology is not mature enough, and the process is relatively complicated. In order to improve the stress and flexibility of the flexible AMOLED bending area, the existing flexible AMOLED manufacturing process needs to etch the inorganic film with poor stress and poor flexibility in the bending area, and then fill it with flexible Better PI (polyi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32H01L21/77
CPCH01L21/77H10K59/124H10K59/131H10K77/111H10K2102/311H10K71/00H10K59/1201
Inventor 陈彩琴
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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