A laser engraving machine for amorphous silicon battery

Abstract

The invention belongs to the technical field of amorphous silicon cell production, and particularly relates to an amorphous silicon cell laser film etching machine. The amorphous silicon cell laser film etching machine comprises a machine frame, an upper air floating plate, lower air floating plates, floating plate adjusting devices, a sweeping device and a laser focusing head; the lower air floating plates are the first lower air floating plate, the second lower air floating plate and the third lower air floating plate from left to right correspondingly; the laser focusing head is arranged between the first lower air floating plate and the second lower air floating plate; the sweeping device is arranged between the second lower air floating plate and the third lower air floating plate; the upper air floating plate is arranged above the first lower air floating plate and the second lower air floating plate; and the floating plate adjusting devices are arranged above the upper air floating plate. According to the amorphous silicon cell laser film etching machine, the sweeping device is arranged so that the upper surface and the lower surface of a glass base plate can be cleaned; byarranging the floating plate adjusting devices, the laser focusing efficiency is improved; and a lower cooling sleeve is arranged, so that the glass base plate is protected against heating deformationafter being etched, and the surface of the glass base plate is prevented from being polluted again.

Description

technical field [0001] The invention belongs to the technical field of amorphous silicon battery production, and specifically relates to a laser engraver for an amorphous silicon battery. Background technique [0002] In the current production process of amorphous silicon cells, it is a very important process to scribe the surface film of the material by laser to separate it. It is to project the laser beam onto the material film after very precise shaping and focusing. Working on the surface, the width of the scribed line is generally required to be between 50 and 60 microns. In order to achieve such a precise line width, it is very strict to control the focus point of the laser. Usually, if the focus point of the laser is slightly deviated, the line width of the scribe will increase significantly, and the energy density of the laser will also become lower. The planned product does not meet the electrical performance requirements of the finished product. However, the raw ...

AI Technical Summary

Problems solved by technology

This technical solution can level the glass substrate before laser scribing, but the glass substrate is not dedusted before film scribing; the air flotation mechanism cannot be adjusted, which affects the efficiency of laser focusing; the hot air and dust generated by laser scribing are not Timely elimination will lead to heat deformation and surface re-contamination of the glass substrate after film engraving

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