Thermosetting shape memory bismaleimide resin and preparation method thereof

A bismaleimide and maleimide sealing technology, which is applied in the field of thermosetting shape memory bismaleimide resin and its preparation, can solve the problem of reducing the shape recovery rate and the shape fixation rate, and it is difficult to have both excellent Heat resistance, high mechanical properties, shape memory properties and good manufacturability, etc., to achieve the effects of high shape recovery rate and shape fixation rate, thermal performance optimization, and toughness improvement.

Active Publication Date: 2020-09-08
SUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The shape fixation rate and shape recovery rate of shape memory polymers based on BMI resins reported so far are usually above 95%, but their glass transition temperature and initial decomposition temperature are often lower than 200 °C and 400 °C, respectively; The transition temperature, which in turn leads to a reduction in the shape recovery rate and shape fixation rate, is lower than 85%
[0006] In summary, the existing technology has made great progress in the research and development of shape memory polymers. However, it is difficult to combine excellent heat resistance, high mechanical properties, excellent shape memory properties and good manufacturability

Method used

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  • Thermosetting shape memory bismaleimide resin and preparation method thereof
  • Thermosetting shape memory bismaleimide resin and preparation method thereof
  • Thermosetting shape memory bismaleimide resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Mix 119.9g of O,O´-diallyl bisphenol A and 10.6g of phenolphthalein polyaryl ether ketone (purchased from Xuzhou Engineering Plastics, the same below), and stir vigorously at 130°C for 20min to obtain a clear and transparent solution. Then, add 100.0g N,N-(4,4-methylenediphenyl)bismaleimide and 10.6g maleimide-terminated hyperbranched polysiloxane to the transparent solution, and Continue to vigorously stir at 130° C. for 30 minutes to obtain a clear and transparent prepolymer. Pour the prepolymer into a preheated mold, put the mold into a vacuum oven at 130° C., and degas it to obtain a precursor for a thermosetting shape memory bismaleimide resin.

[0042] Then, the mold is put into a blast drying oven. The thermosetting shape memory bismaleimide resin precursor was cured according to the curing program of 150°C / 2h+180°C / 2h+200°C / 6h+220°C / 2h, and then post-cured at 240°C for 4h, followed by The oven is naturally cooled to obtain a thermosetting shape-memory bismalei...

Embodiment 2

[0044] 119.9g of O,O´-diallyl bisphenol A and 10.6g of phenolphthalein polyaryl ether ketone were vigorously stirred at 130°C for 20min to obtain a clear and transparent solution, then, 100.0g of N was added to the transparent solution, N-(4,4-methylenediphenyl)bismaleimide and 21.2g hyperbranched polysiloxane, and continue to stir vigorously at 130°C for 30min to obtain a clear and transparent prepolymer, and then The prepolymer is poured into a preheated mold and degassed in a vacuum oven at 130°C. Then, put the mold into the blast drying oven, cure according to the curing program of 150°C / 2h+180°C / 2h+200°C / 6h+220°C / 2h, and then post-cure at 240°C for 4 hours, and let it dry naturally with the oven. After cooling, a thermosetting shape-memory bismaleimide resin is obtained, denoted as BDPH10. Its initial decomposition temperature, glass transition temperature, toughness, flexural strength, rigidity, shape memory process and shape memory performance refer to the attached fi...

Embodiment 3

[0046] 119.9g of O,O´-diallyl bisphenol A and 10.6g of phenolphthalein polyaryl ether ketone were vigorously stirred at 130°C for 20min to obtain a clear and transparent solution, then, 100.0g of N was added to the transparent solution, N-(4,4-methylenediphenyl) bismaleimide and 31.8g hyperbranched polysiloxane, and continue to stir vigorously at 130°C for 30min to obtain a clear and transparent prepolymer, and then The prepolymer is poured into a preheated mold and degassed in a vacuum oven at 130°C. Then, put the mold into the blast drying oven, cure according to the curing program of 150°C / 2h+180°C / 2h+200°C / 6h+220°C / 2h, and then post-cure at 240°C for 4 hours, and let it dry naturally with the oven. After cooling, a thermosetting shape-memory bismaleimide resin is obtained, which is denoted as BDPH15. Its initial decomposition temperature, glass transition temperature, toughness, flexural strength, rigidity and shape memory properties refer to the attached figure 1 , 2 ,...

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Abstract

The invention relates to thermosetting shape memory bismaleimide resin and a preparation method thereof. The preparation method comprises the following steps: adding cardo-polyetherketone into an allyl compound, and performing mixing for 15-35 min at temperature of 130-150 DEG C to obtain a clear liquid; adding bismaleimide and maleimide-endcapped hyperbranched polysiloxane into the clear liquid,and performing a reaction for 15-35 min at temperature of 130-150 DEG C to obtain a prepolymer; and performing defoaming treatment on the prepolymer at temperature of 130-150 DEG C, performing curing,and performing post treatment to obtain the thermosetting shape memory bismaleimide resin. Compared with thermosetting shape memory resin prepared in the prior art, the thermosetting shape memory bismaleimide resin provided by the invention has good processability, does not use a solvent, and has maximum molding (post-treatment) temperature of 240 DEG C; and in addition, the cured resin has highglass transition temperature (>270 DEG C) and initial decomposition temperature (>410 DEG C), high toughness and outstanding shape memory properties at the same time.

Description

technical field [0001] The invention relates to a thermosetting shape memory bismaleimide resin and a preparation method thereof, belonging to the field of functional thermosetting polymers. Background technique [0002] Shape memory polymers refer to a class of polymers that can recover from a temporary shape to their permanent shape under appropriate external stimuli such as light, magnetism, heat, solvents, pH, electricity, or chemistry. Compared with shape memory alloys and shape memory ceramics, shape memory polymers have the advantages of light weight, low cost, good processability, fast deformation speed and moderate transition temperature, and have been used in biomedical, packaging and clothing fields. Since the 21st century, the continuous deepening of human space exploration and the rapid development of artificial intelligence have provided new development opportunities for the development of shape memory polymers. However, at the same time, the mechanical propert...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/12
CPCC08G73/125C08G2280/00
Inventor 顾嫒娟陈帮辉梁国正袁莉
Owner SUZHOU UNIV
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