Unlock instant, AI-driven research and patent intelligence for your innovation.

SiC Mosfet reliability and high-temperature aging test device

A technology for high-temperature aging and testing equipment, which is applied in the direction of measuring equipment, single semiconductor device testing, and electrical measurement. It can solve problems such as single testing conditions, no consideration of heating time, and inability to perform SiCMosfet reliability tests, etc., and achieve the effect of improving experimental accuracy.

Inactive Publication Date: 2018-09-28
CHONGQING UNIV +1
View PDF8 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the test conditions of SiC Mosfet reliability test in the simulated environment are single, such as rain simulation test, high salinity simulation test, without comprehensive environmental simulation, SiC Mosfet reliability test cannot be carried out in the environment of comprehensive factors
In addition, for the SiC Mosfet high temperature aging test, the heating time is not considered when calculating the step time, which reduces the accuracy of the test

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • SiC Mosfet reliability and high-temperature aging test device
  • SiC Mosfet reliability and high-temperature aging test device
  • SiC Mosfet reliability and high-temperature aging test device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] Below in conjunction with accompanying drawing and embodiment the present invention will be further described:

[0021] The invention includes an aging temperature control box, a voltage detector, a current detector and a controller. A salt spray nozzle, a water nozzle and a water mist nozzle are installed on the top surface of the aging temperature control box, a salt spray sensor is installed on the bottom surface of the aging temperature control box, and a controller The output port is connected to the aging temperature control box and the salt spray nozzle, water spray nozzle and water mist nozzle with the control line, and the temperature and humidity sensor, salt spray sensor, voltage detector and current detector in the aging temperature control box are respectively connected to the controller through the data line , the controller includes a memory, a processor, and a computer program stored in the memory that can run on the processor, and the computer program in...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a SiC Mosfet reliability and high-temperature aging test device which comprises an aging temperature control box, a voltage detector, a current detector and a controller, wherein the output port of the controller is connected with the aging temperature control box, a salt mist sprayer, a water sprayer and a water mist sprayer through control lines, the controller comprisesa memory, a processor and a computer program which is stored on the memory and can run on the processor, the processor executes the program to achieve the following steps: 1, performing the test undera humid and hot impact environment; 2, performing the test under a rain environment; 3, performing the test under a high-salinity environment; 4, performing the test under a high-humidity environment; and 5, performing the single-cycle high-temperature aging. The method has the technical effects that the reliability test of the SiC Mosfet under the environment of multiple factors is achieved, when the SiC Mosfet is subjected to the high-temperature aging test, the thermal shock state is set, the effective experiment time is obtained, and the experiment precision is improved.

Description

technical field [0001] The invention belongs to the technical field of component testing, and in particular relates to a SiC Mosfet reliability and high-temperature aging testing device. Background technique [0002] SiC Mosfet is used as an electronic component of a power switch, and its working temperature is usually 155°C~175°C, which requires it to have certain high temperature resistance characteristics. And the working environment of transformers for power grids is outdoors, and power semiconductor devices will generally be used in transformers for power grids. In view of the fact that SiC Mosfets are more and more widely used in industry and power grids, they are reliable in harsh environments such as high humidity, salt spray, and rain. Methods of sex testing are becoming more and more important. [0003] At present, the test conditions of SiC Mosfet reliability test in the simulated environment are single, such as rain simulation test, high salinity simulation test...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26
CPCG01R31/2621G01R31/2628
Inventor 叶怀宇李现兵张朋陈显平钱靖张国旗周强
Owner CHONGQING UNIV