Millimeter wave Massive MIMO antenna unit and array antenna

Abstract

Disclosed is a millimeter wave Massive MIMO antenna unit. The antenna unit comprises a first metal layer, a second metal layer, a fourth metal layer, a sixth metal layer and a connector which are arranged at intervals from the top to bottom in sequence; the first metal layer comprises two parasitic patches; the second metal layer comprises two radiation patches; the fourth metal layer comprises two power dividers, and the two power dividers are electrically connected with the two radiation patches respectively; the sixth metal layer comprises a feeder line, and the feeder line is electricallyconnected with the two power dividers; and the connector is electrically connected with the feeder line. The antenna unit, by utilizing a multilayer PCB technology and a metalized via hole interlayerinterconnecting technology, can make full use of the vertical space; a millimeter wave Massive MIMO array antenna comprises the antenna units in arrangement in 8*16 array, wherein the adjacent two lines of antenna units are arranged in a staggered manner in the line direction, and the adjacent two lines of antenna units are arranged in a staggered manner in the column direction; H polarization isadopted as the polarization mode, and 28G is adopted as the frequency band. The array antenna is low in mutual inductance between array elements, high in electrical performance, compact in structure,low in cost and high in reliability.

Description

technical field [0001] The invention relates to the field of communication antennas, in particular to a millimeter wave Massive MIMO antenna unit and an array antenna. Background technique [0002] As people's requirements for wireless communication are getting higher and higher, the new generation of mobile communication system 5G has become the focus of domestic and foreign research at this stage. The most intuitive feature of 5G is ultra-high-speed transmission. In addition, it also needs to meet the requirements of ultra-large bandwidth, ultra-high capacity, ultra-dense sites, ultra-reliability, and accessibility anytime and anywhere. To achieve the above requirements, it will involve key technologies at multiple levels. At the carrier frequency band level, according to Shannon's theorem C=Blog2(1+S / N), the data rate is closely related to the available spectrum. Since the spectrum of Sub 6G has been fully allocated, millimeter wave (26.5 GHz ~ 300 GHz) has attracted wi...

AI Technical Summary

Problems solved by technology

The two solutions have their own advantages and disadvantages. Because hybrid integration can be modularized, it has advantages in terms of process and cost, and it is easy to locate performance problems. The disadvantage is that the size is larger; direct integration has advantages in size and is more in line with the future Miniaturization requirements, but the corresponding process is more complex and costly

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