PCB and PCBA

A ring groove and solder paste technology, which is applied to printed circuits, printed circuits connected with non-printed electrical components, electrical components, etc., can solve problems such as poor soldering, large amount of solder paste 4', and poor control of the amount , to achieve electrical conduction, improve heat dissipation efficiency, and facilitate placement

Inactive Publication Date: 2018-09-28
DONGGUAN SHENGYI ELECTRONICS
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally speaking, such a structure has the following disadvantages: since the depth control of the metallization groove has a certain tolerance, and the distance from the pad to the groove wall is usually relatively short, in the process of fixing the component 5', the solder paste 4 The amount of 'is not easy to control. A small amount of solder paste 4' will lead to

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • PCB and PCBA
  • PCB and PCBA
  • PCB and PCBA

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0044] Example 1

[0045] This embodiment provides a PCB 1, including a first groove 2 and a second groove 3, wherein the first groove 2 is opened on one side of the PCB 1, and the groove bottom and groove wall of the first groove 2 are metallized , the first groove 2 is provided with solder paste 4, the second groove 3 is a non-metallized groove, which is spaced around the first groove 2, and the first groove 2 notch and the second groove 3 groove No graphics between ports.

[0046] In this embodiment, the PCB 1 is formed by pressing three core boards, but the number is not limited to this. For example, it can also be formed by pressing two or four core boards. Before lamination, at least one prepreg is stacked between two adjacent core boards, and the number of prepregs is selected according to the actual lamination situation.

[0047] This embodiment also provides a PCBA (Printed Circuit Board+Assembly), such as Figure 4As shown, the PCBA includes a component 5 and the ...

Example Embodiment

[0072] Embodiment 2

[0073] This embodiment provides a PCB 1, which is basically the same as the first embodiment. For the sake of simplicity, only the differences between the present embodiment and the first embodiment are described. The structure of the second groove 3 in this embodiment is different from that of the first embodiment.

[0074] like Figure 8 As shown, the second groove 3 includes an annular groove 31 and a plurality of epitaxial grooves 32. The annular groove 31 is opened on the outer circumference of the first groove 2 and is not communicated with the first groove 2. A plurality of epitaxial grooves 32 are arranged in the annular groove 31 at intervals. The outer perimeter of the groove 32 is connected with the annular groove 31. The opening position of the epitaxial groove 32 is selected according to the distribution of the circuit patterns on the surface layer of the PCB 1. Specifically, the epitaxial groove 32 avoids the circuit pattern and is set. Th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to the technical field of a PCB structure, particularly relates to a PCB and a PCBA. The PCB comprises first grooves and non-metalized second grooves, wherein the first grooves are formed in one side of the PCB; the groove bottoms and the groove walls of the first grooves are metalized, and solder paste is arranged in the first grooves; the second grooves are formed around the first grooves at intervals; there is no circuit pattern between the first groove openings and the second groove openings; and the PCBA comprises a component and the PCB. By setting the non-metalizedsecond grooves in the PCB, an accommodating space is provided for little redundant solder paste; by virtue of the non-metalized groove walls of the second grooves, a short circuit phenomenon caused by conduction between solder paste and the circuit pattern on the surface layer when the solder paste overflows from the second grooves to the surface layer of the PCB easily due to overhigh climbing speed can be avoided effectively; and the second grooves and the first grooves are not connected, so that the little redundant solder paste is gradually cooled in the process of flowing to the second grooves, so that it is difficult to enable the solder paste, filled in the second grooves, to overflow to the surface layer of the PCB again to cause the short circuit phenomenon.

Description

technical field [0001] The invention relates to the technical field of PCB structures, in particular to a PCB and a PCBA. Background technique [0002] Printed circuit board (PCB for short) is the provider of electrical connection for electronic components. Before the appearance of printed circuit boards, the interconnection between electronic components relied on the direct connection of wires to form a complete circuit. In contemporary times, circuit panels only exist as effective experimental tools, and printed circuit boards have occupied an absolute dominant position in the electronics industry. [0003] With the development of electronic product technology, in order to save space, the components on the PCB have been developed from surface mount to embedded mount. For embedded placement of certain components, it is required that the circuit patterns of two layers in the mounting area are disconnected (different networks), while the circuit patterns of certain two laye...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K1/02H05K1/18H05K3/34
CPCH05K1/0204H05K1/183H05K3/3478H05K2201/09036H05K2201/09981
Inventor 刘梦茹肖璐纪成光
Owner DONGGUAN SHENGYI ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap