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Wafer photoetching technology

A photolithography process and wafer technology, which is applied in the direction of photolithography coating equipment, electrical components, semiconductor/solid-state device manufacturing, etc., can solve the problems of uniformity and inability to guarantee the thickness of the coating glue on the surface of the wafer, and achieve High efficiency, precise control of the degumming process, and uniform thickness

Active Publication Date: 2018-10-12
新沂展洐数字科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the thickness of the coating glue on the surface of the wafer directly affects the subsequent photolithography steps, which is particularly important for the photolithography process, and the traditional glue leveling device cannot ensure that the thickness of the coating glue on the wafer surface is uniform

Method used

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  • Wafer photoetching technology
  • Wafer photoetching technology
  • Wafer photoetching technology

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Embodiment Construction

[0031] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0032] Such as Figure 1 to Figure 7 Shown, a kind of wafer photolithography process described in the present invention, this photolithography process comprises the following steps:

[0033] Step 1: Fix the prepared wafer on the wafer homogenizing device for lithography machine for homogenizing treatment;

[0034] Step 2: After the glue leveling in step 1 is completed, take out the wafer, pass the glue-coated wafer through the alignment system of the photolithography machine and the photolithography plate, and then use ultraviolet rays to expose the wafer;

[0035] Step 3: after the exposure in step 2 is completed, the photoresist of the exposed part is taken out with a developing solution, and the required pattern is formed on the wafer;

[003...

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PUM

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Abstract

The invention relates to the technical field of wafer photoetching, and in particular relates to a wafer photoetching device. The photoetching device adopted by the technology comprises a fixing frame, a substrate, a horizontal adjustment device, a fixing support, a rotation device, a vacuum suction cup, a vacuum generator, three adjustable springs and a sensing device, wherein the substrate is positioned at the upper part of the fixing frame; the horizontal adjustment device is fixed in the fixing frame; the fixing support is installed on the substrate; the rotation device is installed on thefixing support; the vacuum suction cup is positioned on the rotation device; the vacuum generator is positioned at the lower right side of the vacuum suction cup, and the vacuum generator communicates with the vacuum suction cup; the three adjustable springs are arranged to have included angles of 120 degrees therebetween, and the adjustable springs are positioned between the substrate and the fixing frame; the sensing device is positioned on the fixing frame. According to the device, the situation that the wafer is horizontally fixed on the vacuum suction cup can be effectively ensured, andthus the uniform thickness of glue coated on the surface of the wafer is ensured.

Description

technical field [0001] The invention belongs to the technical field of wafer lithography, in particular to a wafer lithography process. Background technique [0002] Photolithography technology is widely used in the field of micromachining, which can realize efficient and accurate template copying, and is an important process in the production of semiconductor integrated circuits. The development of lithography technology directly affects the nanometer scale of microelectronics technology, and it is a precise microfabrication technology. The photolithography process includes steps such as wafer leveling (that is, coating of adhesive layer), exposure, development, film hardening, corrosion, and adhesive removal. The thickness of the coating glue on the surface of the wafer directly affects the subsequent photolithography steps, which is particularly important for the photolithography process, and the traditional glue leveling device cannot ensure that the thickness of the co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/027G03F7/16
CPCG03F7/16H01L21/0274
Inventor 侯玉闯薛鹏
Owner 新沂展洐数字科技有限公司
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