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Packaging structure and packaging method of OLED

A packaging structure and packaging method technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of poor bending resistance and easy fracture of the packaging part of flexible OLED devices, and achieve the goal of extending the path , Enhance the effect of bending resistance

Inactive Publication Date: 2018-10-16
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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Problems solved by technology

The technical problem existing in the encapsulation structure for flexible OLEDs is: because the encapsulation thickness of the whole thin film is on the order of microns, and the inorganic layer 93 is easily broken when bent, water and oxygen will pass through this break to age the OLED device, making The bending resistance of the packaging part of flexible OLED devices deteriorates

Method used

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  • Packaging structure and packaging method of OLED
  • Packaging structure and packaging method of OLED
  • Packaging structure and packaging method of OLED

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other Embodiment approach

[0046] In other embodiments, after the organic thin film layer is prepared on the first inorganic thin film layer 13 by coating or IJP, the second organic thin film layer 14 having several grooves 140 arranged at intervals is formed thereon through exposure and development processes, The second organic thin film layer 14 forms a plurality of protruding structures arranged at intervals. During specific implementation, the organic thin film layer can be exposed and developed through a Mask or an HTM Mask to form a plurality of protruding structures arranged at intervals.

[0047] The second inorganic thin film layer 15 is prepared by CVD deposition, which is coated on the first inorganic thin film layer 13 , the second organic thin film layer 14 and the second organic thin film layer 14 to form several grooves 140 arranged at intervals.

[0048] Further, it also includes: a third organic thin film layer 16 coated on the second inorganic thin film layer 15 for buffering and flatt...

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Abstract

The invention discloses a packaging structure of an OLED. The packaging structure comprises a substrate, an OLED device, first organic film layers, first inorganic film layers, second organic film layers and second inorganic film layers, wherein the OLED device is formed on the substrate; the first organic film layers are formed on the OLED device, and are of a plurality of raised structures arranged at intervals; the first inorganic film layers are formed on the substrate, the OLED device and the first organic film layers; the second organic film layers are formed on the first inorganic filmlayers; and the second inorganic film layers are formed on the second organic film layers. The invention also discloses a packaging method of the OLED. According to the packaging structure and the packaging method of the OLED disclosed by the invention, the bending resistance of the OLED packaging structure can be strengthened; and the path of water and oxygen entering into the OLED is prolonged,so that the packaging effect is promoted.

Description

technical field [0001] The invention relates to the field of display manufacturing, in particular to an OLED packaging structure and packaging method. Background technique [0002] Organic Light Emitting Display (OLED) has many advantages such as self-illumination, low driving voltage, high luminous efficiency, short response time, high definition and contrast, flexible display and large-area full-color display, etc. It is recognized by the industry as the display device with the most development potential. [0003] The light-emitting materials in OLED devices are usually polymers or small organic molecules, and the cathode materials are usually active metals with low work functions such as magnesium aluminum. These light-emitting materials and cathode materials are very sensitive to water vapor and oxygen, and the penetration of water / oxygen will The lifespan of the OLED device is greatly reduced. In order to meet the commercialization requirements for the lifespan and sta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/8445H10K71/00
Inventor 曾勉
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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