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Minimally inVasiVe spine endoscope piezosurgery head deVice and processing method thereof

A cutter head and ultrasonic technology, which is applied in the fields of endoscopic cutting instruments, grinding scalpels, medical science, etc., can solve the problems of inability to use minimally invasive spinal endoscopic channels, short and thick, etc. The effect of high hardness

Inactive Publication Date: 2018-10-19
林浩
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the ultrasonic bone knife blade used by the operator under direct vision is short and thick, and cannot be used through the minimally invasive spinal endoscopic channel.

Method used

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  • Minimally inVasiVe spine endoscope piezosurgery head deVice and processing method thereof
  • Minimally inVasiVe spine endoscope piezosurgery head deVice and processing method thereof
  • Minimally inVasiVe spine endoscope piezosurgery head deVice and processing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] The No. 1 connecting piece 3 is in line with the cutter bar 2, and the outer side of the No. 1 connecting piece 3 is sleeved with a silicone tube; the grinding head 1 is a flat grinding head; the front end of the flat grinding head is provided with blade teeth, and the direction of the blade teeth is divided into Compared with the plane grinding head, there are three types: upward tilt, forward extension, and downward tilt; the plane grinding head is suitable for cervical spondylotic radiculopathy, and can be used to grind away the protruding part of the joint that compresses the nerve and the hypertrophic osteophyte of the uncinate joint in front of the nerve ; It can also be used to grind away the ossified ligamentum flavum and calcified thoracic intervertebral disc in cases of thoracic ossification of the ligamentum flavum and herniated thoracic intervertebral disc.

Embodiment 2

[0066] A minimally invasive spinal endoscopic ultrasonic osteotome cutter head device, which is different from Embodiment 1 in that: the grinding head 1 is a spherical grinding head, and the spherical grinding head includes a grinding particle spherical grinding head, a toothed spherical grinding head , Oval spherical grinding head.

Embodiment 3

[0068] A minimally invasive spine endoscopic ultrasonic bone knife head device, which is different from Embodiment 1 in that: the grinding head 1 is a blade grinding head, and the blade grinding head includes a toothed blade grinding head and a straight blade grinding head .

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Abstract

The inVention discloses a minimally inVasiVe spine endoscope piezosurgery head deVice and a processing method thereof. The minimally inVasiVe spine endoscope piezosurgery head deVice comprises a grinding head and a piezosurgery rod; the grinding head is arranged at the lower end of the piezosurgery rod through a first connecting piece, and a second connecting piece is fixedly arranged on the upperend of the piezosurgery rod; the grinding head, the first connecting piece, the piezosurgery rod and the second connecting piece form an integrated structure and are integrally arranged; the second connecting piece is diVided into a connecting part connected with the piezosurgery rod and a joint part connected with an ultrasonic transducer; the joint part is arranged on the upper end of the connecting part. The processing method of the minimally inVasiVe spine endoscope piezosurgery head deVice completes processing of the piezosurgery head deVice through multiple steps. The deVice can be usedin a minimally inVasiVe spine endoscope passage, and the use is conVenient, efficient and safe; the surface layer of the piezosurgery head deVice is high in hardness, abrasiVe resistance and fatiguestrength, so that the piezosurgery rod cannot be easily bended; the toughness of a core part is high, so that the piezosurgery deVice can bear impact loading and cannot be easily broken.

Description

technical field [0001] The invention relates to a cutter head device and a processing method thereof, in particular to a minimally invasive spinal endoscopic ultrasonic osteotome cutter head device and a processing method thereof. Background technique [0002] With the continuous development of medical technology, minimally invasive endoscopy such as transforaminal endoscopy is more and more used in operations such as intervertebral disc herniation, lumbar spinal stenosis, and thoracic ossification of the ligamentum flavum. When using a minimally invasive endoscope, the endoscope channel will affect the surgical approach or interfere with the operator's field of view. These bones need to be ground away; in addition, the bone that compresses the nerve also needs to be ground away. The currently used tools for grinding bone include under-scope ring saw, under-scope power drill, etc., but the work efficiency of the under-scope ring saw is low, and it cannot complete the task of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61B17/32A61B17/16
CPCA61B17/320068A61B17/1659A61B17/1671A61B17/320016A61B2017/00526A61B2017/1602A61B2017/320004
Inventor 林浩
Owner 林浩
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