A fingerprint identification device

Abstract

A fingerprint identification device comprising: a circuit board (1), a conductive component (2), a sensor chip (3), a collar (4) and a cover plate (5); the sensor chip (3) passes through the conductive component (2) Installed on the circuit board (1), the collar (4) is arranged around the outer side of the sensor chip (3), and the cover plate (6) covers the sensor chip (3) and the collar (4) above. The above-mentioned fingerprint identification device adds a collar (4) with a color and material closer to it on the outside of the sensor chip (3) in the smallest package, while solving the problem that the size of the sensor chip (3) in the smallest package cannot meet the appearance requirements, and avoiding The problem of using the support frame that the cover plate (6) is easily pulled by stress after being bonded to cause deformation and the color difference after the cover plate (6) is bonded is solved, and the cost of the module is reduced.

Description

technical field [0001] The invention relates to the technical field of biological identification, in particular to a fingerprint identification device. Background technique [0002] At present, as consumers are increasingly pursuing product appearance, the internal components and modules of consumer electronics products are also increasingly pursuing the ultimate in performance and craftsmanship. Such as figure 1 Shown is a schematic structural diagram of an existing fingerprint module. The existing fingerprint module includes components such as a cover plate 1 , a sensor packaging sheet 2 , a circuit board 3 , and a support frame 4 . [0003] The smallest package sensor chip is usually used in the existing fingerprint module. However, since the size of the smallest packaged sensor chip often cannot meet the user's requirements for the appearance, it is necessary to pass such as figure 1 The shown support frame 4 is used to fill other spaces; since the material of the su...

AI Technical Summary

Problems solved by technology

However, since the size of the smallest packaged sensor chip often cannot meet the user's requirements for the appearance, it is necessary to pass such as figure 1 The shown support frame 4 is used to fill other spaces; since the material of the support frame is usually metal, and the material of the smallest packaged sensor chip is resin, the thermal expansion coefficient of the two is different due to the temperature during the assembly process, and the bonding of the cover plate Easily deformed by stress

In addition, there is also a large difference in the color of the support frame and the smallest package sensor chip, and the color difference often occurs after the cover plate is pasted.

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