Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A device and method for compound milling to process microstructures

A milling processing and microstructure technology, applied in metal processing equipment, manufacturing tools, other manufacturing equipment/tools, etc., can solve the problem of tool life, reduction of processing efficiency, processing accuracy, deterioration of surface integrity, and insufficient overall strength and rigidity, etc. problems, to achieve the effect of improving processing efficiency and processing accuracy

Active Publication Date: 2019-11-19
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Especially when processing microstructures with high aspect ratios, micromilling cutters with large aspect ratios are prone to chipping and breaking due to insufficient overall strength and rigidity, resulting in reduced tool life, machining efficiency, and machining accuracy, as well as surface integrity changes. Difference

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A device and method for compound milling to process microstructures
  • A device and method for compound milling to process microstructures
  • A device and method for compound milling to process microstructures

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] The purpose of the present invention is to provide a device and method for compound milling to process microstructures, to solve the above-mentioned problems in the prior art, improve the machining accuracy of microstructures, reduce the blade wear of micromilling cutters, and improve the use of micromilling cutters life.

[0028] In order to make the above objects, features and advantages of the present invention more comprehensible, the present...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
widthaaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a combined milling cutting processing device of a microstructure. The device comprises a laser and a fine milling cutter. The device is applicable to processing of a high depth-to-width ratio and complex long-route microstructure on a metal material or a nonmetal solid material. The invention also provides a combined milling cutting processing method of the microstructure.The method is characterized in that a workpiece to be processed is roughly processed to remove materials through a laser to obtain the microstructure, then the fine milling cutter is arranged at an inlet of the microstructure obtained by rough processing, and the fine milling cutter is driven to mill and cut the microstructure, and thus the final microstructure is obtained. With the adoption of the device and the method, the microstructure processing efficiency and processing accuracy can be improved; and meanwhile, the blade abrasion degree of the fine milling cutter is decreased, and the service life of the fine milling cutter is prolonged.

Description

technical field [0001] The invention relates to the technical field of micromanufacturing, in particular to a device and method for compound milling to process microstructures. Background technique [0002] Microstructures with a characteristic size of 0.01mm to 2mm are widely used in key parts of cutting-edge equipment in the fields of national defense, aviation, aerospace, energy and medical treatment. With the increasing maturity of micro-miniature technology, the development of micro-processing technology has been greatly promoted. The quality of the surface integrity of the microstructure directly affects the technical indicators related to the microstructure, such as electromagnetic, optical, vibration and fatigue. Structures, complex microstructures such as X-ray collimating gratings with a feature width of 0.01 mm to 1 mm for deep space exploration require high surface integrity. Many existing mature micromachining technologies, such as photolithography, microelectr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B23P23/04
CPCB23K26/0093B23K26/60B23K26/702B23P23/04
Inventor 郝秀清王琛夏浥韩锦锦何宁李亮
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com