Tin plating method and automatic tin plating device

Abstract

The invention discloses a tin plating method which comprises the following steps that a jig regulates an included angle between a chip and a horizontal plane according to the position of a Pin to be tinned on the chip; a main control module generates a reference position according to the position of a tin face and controls a mechanical arm root to descend to a preset value to enable the Pin to besoaked into the tin face for tin plating; a mechanical arm rises to enable the chip to be tinned to leave the tin face; and the steps are executed in a circulation manner until all the Pins on the chip are tinned, and the chip is sent out. For the tin plating method provided by the invention, by detecting the height of the tin face before each time of tin plating, enabling the main control moduleto reset the reference position according to the height of the tin face and controlling the tin plating operation through the main control module, the depth of the chip soaked into the tin face as well as the accuracy and the stability of duration are ensured, automation operation of chip tin plating is realized, and the processing efficiency is improved while the rate of good product is increased. The invention also discloses an automatic tin plating device for the tin plating method.

Description

technical field [0001] The invention relates to the field of integrated circuit processing, in particular to a tinning method and an automatic tinning device. Background technique [0002] Integrated circuits usually have pins for communicating with external circuits. In order to facilitate subsequent soldering operations, a layer of tin will be pre-plated on the Pin during the preparation process. [0003] The existing tinning method is to prepare a tin bath containing molten liquid tin. The operator holds the material to be tinned by the equipment, applies flux on the pin of the material, and then puts the material into the tin bath. , After waiting for a certain period of time, the control device will be taken out and the tinning will be completed. [0004] The problem is that the tinning time cannot be accurately controlled during manual tinning, and the time for the material to immerse in the tin bath may be too long or too short. The depth will also lead to poor tin...

AI Technical Summary

Problems solved by technology

[0004] The problem is that the tinning time cannot be accurately controlled during manual tinning, and the time for the material to immerse in the tin bath may be too long or too short. The depth will also lead to poor tinning of product pins, which will seriously affect the yield rate of tinning processing

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