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Improved soldering paste and preparation method thereof

An improved technology for solder paste, applied in the direction of chemical instruments and methods, dissolving, mixing machines, etc., can solve the problems of constant mixing drum, low efficiency, high labor intensity, etc.

Inactive Publication Date: 2018-11-13
广州上成科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Solder paste needs to be mixed and stirred in the processing and production. Traditionally, this is mostly manual operation, which is labor-intensive and low-efficiency. There are also many automatic stirring devices in the existing market, but most of the mixing drums are built in It is extremely unchanged when it is disassembled, cleaned, replaced and installed, and there are major disadvantages that need to be improved

Method used

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  • Improved soldering paste and preparation method thereof
  • Improved soldering paste and preparation method thereof

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Embodiment Construction

[0018] All features disclosed in this specification, or steps in all methods or processes disclosed, may be combined in any manner, except for mutually exclusive features and / or steps.

[0019] Any feature disclosed in this specification (including any appended claims, abstract and drawings), unless expressly stated otherwise, may be replaced by alternative features which are equivalent or serve a similar purpose. That is, unless expressly stated otherwise, each feature is one example only of a series of equivalent or similar features.

[0020] Such as Figure 1-2 As shown, an improved solder paste equipment of the device of the present invention includes a frame body 12 and a box shell 41, and the box shell 41 is provided with an installation cavity 11 with the port upward, and the inner bottom of the installation cavity 11 is The left and right sides of the wall are correspondingly provided with insertion grooves 12, and the inner bottom wall of the installation cavity 11 b...

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Abstract

The invention discloses improved soldering paste equipment. The improved soldering paste equipment comprises a frame body and a tank shell, wherein an installation cavity with an upward end opening isformed in the tank shell; left and right inserting grooves are correspondingly formed in the inner bottom wall of the installation cavity; a first sliding cavity is formed in the inner bottom wall ofthe installation cavity between the left and right inserting grooves in a downward stretching way; the inner bottom wall of the first sliding cavity is communicated with a first rotating cabin stretching left and right; a first sliding and pushing block is movably arranged in the first sliding cavity; a first motor is arranged in the end surface of the top part of the first sliding and pushing block; the top part of the first motor is in power connection with a spline shaft; a first threaded hole with a downward end opening is formed in the first sliding and pushing block; a first stud is arranged in the first threaded hole in a matching way.

Description

technical field [0001] The invention relates to the technical field of welding materials, in particular to an improved solder paste and a preparation method thereof. Background technique [0002] Solder paste is a new type of soldering material that emerged with SMT. It is a paste mixture formed by mixing solder powder, flux, and other surfactants and thixotropic agents. It is mainly used for soldering electronic components such as PCB surface resistance, capacitor and IC in SMT industry. Solder paste needs to be mixed and stirred in the processing and production. Traditionally, this is mostly manual operation, which is labor-intensive and low in efficiency. There are also many automatic stirring devices in the existing market, but most of the mixing drums are built in It is extremely unchanged during disassembly, cleaning and replacement and installation, and there are major disadvantages that need to be improved. Contents of the invention [0003] Aiming at the defic...

Claims

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Application Information

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IPC IPC(8): B01F7/18B01F15/00
CPCB01F27/808B01F27/90B01F35/453
Inventor 莫业进
Owner 广州上成科技有限公司
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