Improved soldering paste and preparation method thereof
An improved technology for solder paste, applied in the direction of chemical instruments and methods, dissolving, mixing machines, etc., can solve the problems of constant mixing drum, low efficiency, high labor intensity, etc.
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[0018] All features disclosed in this specification, or steps in all methods or processes disclosed, may be combined in any manner, except for mutually exclusive features and / or steps.
[0019] Any feature disclosed in this specification (including any appended claims, abstract and drawings), unless expressly stated otherwise, may be replaced by alternative features which are equivalent or serve a similar purpose. That is, unless expressly stated otherwise, each feature is one example only of a series of equivalent or similar features.
[0020] Such as Figure 1-2 As shown, an improved solder paste equipment of the device of the present invention includes a frame body 12 and a box shell 41, and the box shell 41 is provided with an installation cavity 11 with the port upward, and the inner bottom of the installation cavity 11 is The left and right sides of the wall are correspondingly provided with insertion grooves 12, and the inner bottom wall of the installation cavity 11 b...
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