Electronic package and method for fabricating the same

Abstract

An electronic package and a method for fabricating the same are provided. The method includes forming an antenna structure in contact with one side of a circuit structure of a packaging substrate, anddisposing an electronic component on the other side of the circuit structure. As such, the antenna structure is integrated with the packaging substrate, thereby reducing the thickness of the electronic package and improving the efficiency of the antenna structure.

Description

technical field [0001] The present invention relates to an electronic package, in particular to an electronic package with an antenna structure and a manufacturing method thereof. Background technique [0002] With the vigorous development of portable electronic products in recent years, the development of various related products is also moving towards the trend of high density, high performance, light, thin, short and small. For this reason, the industry has developed various integrated multi-functional packages. In order to meet the requirements of light, thin, short and high density of electronic products. For example, with the development of mobile communication devices in recent years, in addition to product requirements such as performance enhancement and component size reduction, chips with low noise characteristics have also been developed to achieve the balance of semiconductor components. Therefore, the current wireless communication technology It has been widely...

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Problems solved by technology

[0004] However, in the existing semiconductor communication module 1, before disposing the semiconductor element 13 on the packaging substrate 10, the antenna substrate 11 needs to be bonded to the packaging substrate 10 first, so the bonding part 15 needs to be fabricated, thus resulting in complicated manufacturing process. and will increase manufacturing costs

[0005] In addition, the antenna substrate 11 is composed of an organic board, so the antenna substrate 11 has a very large thickness H, which not only makes it difficult for the semiconductor communication module 1 to meet the miniaturization requirements, but also makes the antenna of the semiconductor communication module 1 Poor performance (because the thickness will affect the antenna performance)

[0006] In addition, the use of the antenna substrate 11 will result in the accumulation of tolerances, such as manufacturing tolerances, tape tolerances, solder ball tolerances, etc. of the antenna substrate 11, and the semiconductor communication module 1 cannot be accurately controlled due to the accumulation of excessive tolerances. thickness, making it difficult to achieve the purpose of reducing the semiconductor communication module 1, which does not meet the needs of product miniaturization

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