Assembled circuit board detection system and assembled circuit board detection method

Abstract

The invention relates to an assembled circuit board detection system. The system includes a detection platform, an image pickup device, a pressing and abutting plate and a computing host; the detection platform is provided with a carrying surface which is used for carrying an assembled circuit board and is provided with a plurality of circuit detection contacts; the image pickup device photographsthe assembled circuit board on the carrying surface to generate an image to be detected; the pressing and abutting plate is movably disposed between the detection platform and the image pickup device; the pressing and abutting plate is provided with a light transmitting portion aligned with the image pickup device; the pressing and abutting plate is used for pressing and abutting against the assembled circuit board, so that the connection pins of the plurality of material components of the assembled circuit board can be electrically connected with the circuit detection contacts; the computinghost is electrically connected with the detection platform and the image pickup device so as to receive the image to be detected, execute an image analysis program and test the material components ofthe assembled circuit board through the detection platform.

Description

technical field [0001] The present invention relates to an assembled circuit board inspection system and an assembled circuit board inspection method, in particular to an assembled circuit board inspection system integrating Automated-Optical Inspection (AOI) and In Circuit Tester (ICT) And the detection method of assembled circuit board. Background technique [0002] In the process of manufacturing electronic products, various electronic components must be assembled on a printed circuit board (PCB). These electronic components can usually adopt surface mount technology (Surface Mount Technology, SMT) or dual in-line package (Dual In Line Package, DIP) process. Among them, the assembly method of DIP process parts is to insert the pins of DIP parts into the plating through hole (PTH) on the printed circuit board, and apply flux on the bottom of the printed circuit board, and then solder the parts through the solder furnace. It is fixed on the printed circuit board, and then...

AI Technical Summary

Problems solved by technology

However, due to the current situation that the hardware equipment of the test machine is individually set independently, the test items that can theoretically be processed at the same time must be divided into multiple stations to carry out sequentially, resulting in an extremely long total test time for a single assembled circuit board and inefficient

In addition, due to the large number of DIP parts on the assembled circuit board, the operator who cooperates with the test machine is prone to make mistakes in the visual inspection process due to factors such as negligence and fatigue, resulting in the failure of the assembled circuit board to maintain a stable yield rate, and therefore additional Increase the cost of rework after the test goes wrong

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