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Temperature compensation method of resonant sensor based on continuous ring-down

A resonant sensor, temperature compensation technology, applied in the field of temperature compensation, can solve the problem of inability to achieve zero-distance temperature measurement

Active Publication Date: 2020-10-20
NANJING UNIV OF SCI & TECH
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Problems solved by technology

Document 3 (Wang Fan, Dong Jingxin, Zhao Shuming. Temperature detection and closed-loop control of silicon micro-vibrating beam accelerometer [J]. Optical Precision Engineering, 2014, 22(6): 1590-1597.) discloses a sputtering-based The extra metal layer is used as an on-chip temperature sensor solution. Although these two solutions reduce the temperature measurement error to a certain extent, they still cannot achieve zero-distance temperature measurement.

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  • Temperature compensation method of resonant sensor based on continuous ring-down
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  • Temperature compensation method of resonant sensor based on continuous ring-down

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Embodiment Construction

[0015] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0016] The Q value (quality factor) is a quantity that characterizes the damping characteristics of the system, reflecting the attenuation characteristics of the system. It is made up of many factors, including: air damping (Q 空气 ), thermoelastic damping (Q TED ), anchor point damping (Q 锚点 )Wait. The calculation formula of Q value can be expressed as:

[0017]

[0018] These damping factors will change with the temperature. For example, the relationship between the thermoelastic damping of the beam and the temperature can be expressed as:

[0019]

[0020] where E ad is the Young's modulus under non-relaxation or adiabatic conditions, E is the Young's modulus under relaxation or isothermal conditions, α is the thermal expansion coefficient of the material, T 0 is the system temperature, C v is specific heat capacity at constant volume, w is beam...

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Abstract

The present invention discloses a resonant-mode sensor temperature compensation method based on continuous ring-down. The method comprises the steps of: adding amplitude comparer and a trigger and constructing a continuous ring-down system to test the ring-down time and show a Q value after a link of a resonator closed-loop self-excitation drive system amplitude detection; performing continuous ring-down test in a total-temperature range, obtaining the Q value and a corresponding resonator frequency, and performing linear fitting of the frequency by employing the Q value to obtain variation ofthe frequency caused by temperature errors; and finally, measuring the frequency and the Q value of the resonator, and combining the fitting curve to perform temperature compensation of the resonantfrequency. The resonant-mode sensor temperature compensation method eliminates different temperature measurement points of an external temperature sensor having errors in the tested temperature and temperature measurement hysteresis effect caused in the temperature drop and rise process and improves the stability of the resonant.

Description

technical field [0001] The invention relates to temperature compensation technology, in particular to a method for temperature compensation of a resonant sensor based on continuous ring-down. Background technique [0002] In recent years, MEMS resonators have received a lot of attention and research, but the resonant frequency of MEMS resonators is easily affected by temperature drift, which restricts its practical application. In order to improve the temperature performance of the MEMS resonator, the temperature error of the resonator is usually compensated. Then, the accuracy of temperature measurement determines the quality of temperature compensation. [0003] Document 1 (Lee K I, Takao H, Sawada K, et al.Improvement of thermal response in temperature controlled precise three-axis accelerator with stabilized characteristics over a wide temperature range[C] / / The, International Conference on Solid-State Sensors, Actuators and Microsystems ,2005.Digest ofTechnical Papers....

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01D3/036G01R31/00
CPCG01D3/036G01R31/00
Inventor 王雅刚朱欣华苏岩
Owner NANJING UNIV OF SCI & TECH