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Receiving and transmitting device

A technology of transceiver devices and components, applied in the field of flexible electronic devices, can solve problems such as electromagnetic compatibility problems, achieve the effect of reducing the number of devices, alleviating electromagnetic compatibility and heat dissipation problems

Active Publication Date: 2018-11-16
浙江荷清柔性电子技术有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of complex electromagnetic environment and high integration density of electronic components, more electronic components with repetitive functions will bring electromagnetic compatibility problems and heat dissipation problems

Method used

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  • Receiving and transmitting device
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Embodiment Construction

[0036] Various exemplary embodiments, features, and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. The same reference numbers in the figures indicate functionally identical or similar elements. While various aspects of the embodiments are shown in drawings, the drawings are not necessarily drawn to scale unless specifically indicated.

[0037] The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as superior or better than other embodiments.

[0038] In addition, in order to better illustrate the present disclosure, numerous specific details are given in the following specific implementation manners. It will be understood by those skilled in the art that the present disclosure may be practiced without some of the specific details. In some instances, methods, means, componen...

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Abstract

The invention relates to a receiving and transmitting device, which comprises a control component, a first signal processing component, a second signal processing component, a unidirectional transmission component, a switch component, a phase shifting component and a flexible substrate, wherein the control component is used for controlling the switch component to perform switching and enabling a receiving branch to be conducted when the receiving and transmitting device receives first signals through a first end, and controlling the switch component to perform switching and enabling a transmitting branch to be conducted when the receiving and transmitting device receives second signals through a third end; and the flexible substrate is made of a flexible material for bearing the control component, the first signal processing component, the second signal processing component, the unidirectional transmission component, the switch component and the phase shifting component. Through controlling the switch component, the receiving branch and the transmitting branch can be conducted selectively, time division multiplexing of the phase shifting component by the receiving branch and the transmitting branch can be achieved, the number of devices can be reduced, and the problems of electromagnetic compatibility and heat radiation can be lessened.

Description

technical field [0001] The present disclosure relates to the field of flexible electronic devices, in particular to a transceiver. Background technique [0002] In modern phased array radar, a transceiver device is connected between each antenna and the IF processor, which is mainly used for preliminary processing of microwave signals, such as amplification, attenuation, shifting, etc., which is the core component of radar technology. Compared with the passive phased array radar, the active phased array radar connected by the transceiver device has lower energy loss, longer detection distance, and better heat dissipation, so it is widely used. As the demand for radar system performance is getting higher and higher, higher requirements are also put forward for the transceiver device, such as high precision, high resolution, and small size. [0003] System-in-package technology (SIP) is a technology that integrates multiple electronic components such as chips with different f...

Claims

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Application Information

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IPC IPC(8): G01S13/02G01S7/282G01S7/285G01S7/35
CPCG01S7/282G01S7/285G01S7/352G01S13/02
Inventor 冯雪郑坤炜蔡世生
Owner 浙江荷清柔性电子技术有限公司
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