Silicon ingot grinding device

A technology of silicon ingots and mounting racks, which is applied in the directions of grinding machines, grinding slides, grinding racks, etc., can solve the problems of no auxiliary equipment, high grinding labor intensity, and can not meet production needs, so as to meet the needs of use and achieve rapid grinding. Effect

Pending Publication Date: 2018-11-23
ZHENJIANG DACHENG NEW ENERGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Silicon ingot is the pre-order material before single crystal silicon wafer processing. After cutting, the cut silicon ingot needs to be polished. However, the current grinding method is to grind with a hand-held grinder. There is no auxiliary equipment, and the grinding is labor-intensive. , cannot meet the production demand

Method used

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  • Silicon ingot grinding device
  • Silicon ingot grinding device

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Embodiment Construction

[0013] Such as Figure 1-2 It is a schematic diagram of the structure of the present invention, a silicon ingot grinding device, the two sides below the installation frame 1 of the device are support plates 2, and a motor 8 is placed on the installation frame 1, and a grinding sheet 12 is connected to the bottom of the motor 8.

[0014] When the motor 8 installed on the mounting frame 1 is powered on, the motor 8 drives the grinding sheet 12 connected to the motor shaft to work, and then the silicon ingot 13 placed in the middle of the mounting frame 1 is polished.

[0015] According to another embodiment of the present invention, it further includes that the motor 8 is installed and fixed in the housing 7, the lower part of the housing 7 is connected with the roller 11 through a connecting rod, the roller 11 is stuck in the roller groove 10 of the mounting frame 1, and the upper part of the housing 7 is fixed armrest9.

[0016] The motor 8 is fixed in the shell 7 by bolts, a...

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Abstract

The invention relates to the technical field of silicon ingot machining, in particular to a silicon ingot grinding device. According to the silicon ingot grinding device, support plates are arranged at the two sides below a mounting bracket; a motor is put on the mounting bracket; and a grinding piece is connected below the motor. When the silicon ingot grinding device is used, the device is mounted on a silicon ingot; when the motor is started to drive the grinding piece to work, the moving motor drives the grinding piece to move forwards and backwards; and the surface of the silicon ingot can be ground rapidly, and the using requirement is met.

Description

technical field [0001] The invention relates to the technical field of silicon ingot processing, in particular to a silicon ingot grinding device. Background technique [0002] Silicon ingot is the pre-order material before single crystal silicon wafer processing. After cutting, the cut silicon ingot needs to be polished. However, the current grinding method is to grind with a hand-held grinder. There is no auxiliary equipment, and the grinding is labor-intensive. , cannot meet the production demand. Contents of the invention [0003] In order to overcome the shortcomings of the existing silicon ingot grinding, the invention provides a silicon ingot grinding device. [0004] The technical solution adopted by the present invention to solve the technical problem is: a silicon ingot grinding device, the device has support plates on both sides below the mounting frame, a motor is placed on the mounting frame, and a grinding sheet is connected below the motor. [0005] Accord...

Claims

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Application Information

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IPC IPC(8): B24B19/22B24B41/02B24B41/06
CPCB24B19/22B24B41/02B24B41/06
Inventor 黄昱方荣于松付月姣
Owner ZHENJIANG DACHENG NEW ENERGY
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