Multi-layer ceramic capacitor and fabrication method thereof

Abstract

The invention discloses a fabrication method of a multi-layer ceramic capacitor. According to the fabrication method, combustion-auxiliary particles and a lamination body are mixed and placed on a combustion bearing plate, the lamination body is sintered, a combustion-helping constituent in the combustion-auxiliary particles is volatilized so that local atmosphere with relatively high volatilization concentration is formed around the lamination body, excessive volatilization of the combustion-helping constituent in the lamination body can be prevented, and the ceramic body obtained after sintering is uniform and compact and is good in consistency. The step of lamination is performed during preparation of the combustion-auxiliary particles, the density is relatively large, and the enough local atmosphere can be provided for the lamination body during sintering; the combustion-auxiliary particles are small in size and irregular in shape, relatively-large area contact cannot be formed between the combustion-auxiliary particles and the lamination body when the combustion-auxiliary particles and the lamination body are mixed, and the ceramic body after sintering is difficult to paste with the combustion-auxiliary particles; and the lamination body with relatively small volume can be pasted, a binding agent in the lamination body is thoroughly eliminated, and the compactness and thedielectric performance of the ceramic body are relatively good.

Description

technical field [0001] The invention relates to a capacitor and a preparation method thereof, in particular to a multilayer ceramic capacitor and a preparation method thereof. Background technique [0002] The preparation of multilayer ceramic capacitors with copper inner electrodes requires the use of low-temperature sintered ceramic materials in order to co-fire with copper inner electrodes. Sintered dense. Since the sintering aid components tend to volatilize easily during high-temperature sintering, it is easy to cause the problem of deterioration of the consistency of the ceramic chips loaded on the same setter. Specifically, when the ceramic chips loaded on the same setter are sintered at high temperature, the ceramic chips with a higher loading density can hinder the volatilization due to the higher concentration of the volatile atmosphere of the firing aid components, so more of the firing aid components remain. The formation of a liquid phase in the ceramic chip p...

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Problems solved by technology

However, since the debonding is carried out on the larger volume of the third substrate, there is a problem that the binder contained in the laminate is not completely removed, so that the density and uniformity of the sintered ceramic body are reduced.

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