High efficiency heat dissipation power amplifier manufacturing method and heat dissipation cabinet
A technology of a power amplifier and a manufacturing method, which is applied in cooling/ventilation/heating transformation, chassis/cabinet/drawer parts, electrical equipment structural parts, etc. High resistance, inability to spread the power amplifier chip, etc., to achieve the effect of reducing grounding resistance, reducing weight and volume, and reducing volume and weight
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[0030] In order to make it easier for those skilled in the art to understand the technical solution of this patent, and at the same time, in order to make the technical purpose, technical solution and beneficial effect of this patent clearer, and to fully support the protection scope of the claims, the following is a specific case in the form of this patent. The technical solution of the patent makes further and more detailed descriptions.
[0031] A method for manufacturing a high-efficiency heat dissipation power amplifier, comprising the following steps:
[0032] (1) Prepare the plate as the box wall and heat dissipation fins, weld the box wall to form a heat dissipation chassis, and weld the heat dissipation fins to the outside of the heat dissipation chassis; there are one or more device cavities inside the heat dissipation chassis, and at least one device cavity is a power amplifier Cavity;
[0033] (2) Mill one or more chip mounting slots on the bottom wall of the powe...
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