Heat dissipation device of a system integrated circuit boar
A technology for integrated circuit boards and cooling devices, which is applied to circuits, electrical components, and electric solid devices, and can solve the problems of inconvenient system integrated circuit board cooling, slow cooling speed of cooling fans, and poor cooling effect, so as to reduce the temperature and speed up the cooling process. Dissipate heat and save energy
Active Publication Date: 2018-11-30
安徽吉仪仪表科技有限公司
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Problems solved by technology
[0006] Aiming at the deficiencies of the prior art, the present invention provides a heat dissipation device for the system integrated circuit board, which solves the problems of the heat dissipation of the micro fan, poor heat dissipation effect, slow heat dissipation speed of the heat dissipation fan, and inconvenient cooling of the system integrated circuit board
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[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0021] see Figure 1-3 As shown, an embodiment provided by the present invention; a heat dissipation device for a system integrated circuit board, including a circuit board body 1, a cooling pipe 4, a temperature sensor 5, a delivery pump 9, a controller 11, a cooler 12 and a miniature radiator Fan 14, the circuit board body 1 is installed on the mounting base 2, the circuit board body 1 is fixed on the mounting base 2 through the splint 3, the left and right ...
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The invention discloses a heat dissipation device of a system integrated circuit board. The heat dissipation device comprises a circuit board body, a cooling pipe, a temperature sensor, a conveying pump, a controller, a cooler and a micro heat dissipation fan; the circuit board body is mounted on a mounting bas, and the circuit board body is fixed on the mounting base through a clamping plate; thetemperature sensor is arranged at the lower part of the circuit board body; the cooling pipe is arranged outside the circuit board body, and the left end of the cooling pipe is communicated with a liquid outlet pipe; the lower end of the liquid outlet pipe is arranged on a liquid storage tank; the right side of the liquid storage tank is provided with a liquid conveying pipe; and the liquid conveying pipe is provided with a conveying pump. The invention provides the heat dissipation device of the system integrated circuit board, and by virtue of the circuit board body, the cooling pipe, thetemperature sensor, the conveying pump, the controller, the cooler and the micro heat dissipation fan, the problems that the micro fan is poor in heat dissipation effect, the heat dissipation fan is low in heat dissipation speed, and cooling of system integrated circuit board is inconvenient are solved.
Description
technical field [0001] The invention relates to the field of auxiliary technology for system integrated circuit boards, in particular to a heat dissipation device for system integrated circuit boards. Background technique [0002] The system integrated circuit board is a kind of miniature electronic device or component. It adopts a certain process to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit, and make them in one or several small semiconductors. Chip or dielectric substrate, and then encapsulated in a package to become a microstructure with the required circuit functions; all the components have been structurally integrated, making electronic components towards miniaturization, low power consumption, intelligence and A big step forward in high reliability. [0003] However, existing system integrated circuit boards have the following disadvantages: [0004] 1. In the process of use, it is easy to ge...
Claims
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IPC IPC(8): H01L23/467H01L23/473
CPCH01L23/467H01L23/473
Inventor 陈兆康彭申海
Owner 安徽吉仪仪表科技有限公司