Mounting method for spacecraft electronic product CQFP device
A technology for electronic products and installation methods, which is applied in the direction of assembling printed circuits, electrical components, printed circuits, etc. with electrical components, and can solve problems such as reduced production efficiency, poor solder joint consistency, and long curing time of adhesives, so as to improve production efficiency , The effect of saving curing time
Active Publication Date: 2018-11-30
BEIJING INST OF CONTROL ENG
View PDF4 Cites 3 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0008] (1), (2), (3), (4) described CQFP welding, the defective that reinforcement method exists is: can not realize that welding, gluing reinforcement are finished in the same procedure, can only carry out the spot sealing of adhesive first, Curing and then completing welding, or completing welding first, then sealing adhesive and curing
On the one hand, the curing time of the adhesive is longer, which greatly reduces production efficiency. On the other hand, if manual soldering is used, it will also lead to poor consistency of solder joints, which will have a significant impact on the reliability of solder joints
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0028] A method for installing a CQFP device of an electronic product of a spacecraft, the steps of the method are:
[0029] (1) Use a chip forming machine to complete the forming of the CQFP device to ensure that the coplanarity of the pins is less than 0.07mm. After forming, the gap between the bottom of the CQFP device and the PCB is 0.5-0.7mm;
[0030] (2) Use a screen printing machine to complete the solder paste printing on the PCB pad, and apply the high-temperature curing epoxy adhesive to the middle area of the CQFP device silk screen of the PCB using a dot coating or screen printing method;
[0031] The solder paste is: 63Sn37Pb eutectic INDIUM NC-SMQ92J No. 3 powder;
[0032] The raw materials of the high-temperature curing epoxy adhesive include epoxy 3817LV glue and talcum powder. Taking the total mass of the high-temperature curing epoxy adhesive as 100%, the mass content of the epoxy 3817LV glue is 67%-75%. The mass content is 25%-33%; the preparation method ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to a mounting method for a spacecraft electronic product CQFP device, in particular to a method for mounting the CQFP device on a circuit board, and belongs to the technical field of electronic assembly technologies. The method is a process method that reflow soldering and gluing reinforcement of the CQFP device are synchronously completed. The invention provides a process for synchronous completion of reflow soldering and gluing reinforcement of the CQFP device. After a soldering paste is printed, a high-temperature solidification epoxy adhesive is subjected to through printing on the PCB, by matching with a specific reflow soldering curve setting and gluing process, adhesive second-level solidification and device interconnection solder joint soldering are synchronously completed through the reflow soldering heating process, thus gluing reinforcement and solder joint soldering are simplified into one working procedure, the solidification time for gluing reinforcement is saved, the production efficiency is improved, and meanwhile consistency and reliability of the soldering and reinforcement process are improved.
Description
technical field [0001] The invention relates to a method for installing CQFP devices used in spacecraft electronic products, in particular to a method for installing CQFP devices on a circuit board. Electronic assembly technology field. Background technique [0002] CQFP packaging is one of the most commonly used packaging forms for core components in spacecraft electronics, such as figure 1 As shown, it achieves the lead-out of internal chip signals by leading out gull-wing pins on the four sides of the ceramic package body, and then realizes the interconnection of board-level circuits through tin-lead soldering between the pins and the PCB pad. Due to the particularity of the pin structure and body weight, coupled with the harsh external load environment, in addition to completing the soldering of the CQFP package pins before the product is put into service, it is also necessary to use electronic adhesives for board-level reinforcement of the device. The process of weldi...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H05K3/30H05K3/34
CPCH05K3/305H05K3/341H05K3/3494H05K2203/043
Inventor 于方李思阳吴广东李海滨丁颖孟宪刚任江燕郭文强晏杰张玉卿胡秋宁
Owner BEIJING INST OF CONTROL ENG