Preparation method of touch display screen and bonding device
A technology of touch screen and bonding equipment, applied in the input/output process of data processing, instruments, electrical digital data processing and other directions, can solve problems such as low production efficiency, improve production efficiency, reduce manufacturing costs, and save time effect of time
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[0045] The preparation method of the touch display screen provided by the present invention is to squeeze the touch screen and the TFT module in a non-vacuum state. By squeezing the touch screen and the TFT module, the touch screen and the TFT module can be pressed together. The air bubbles can be discharged. The method can be realized in a non-vacuum state, and the equipment does not need to be evacuated, thereby saving the time of evacuating and improving the production efficiency.
[0046] In addition, the present invention innovatively uses an extrusion method to bond the touch screen and the TFT module in a non-vacuum state, which is completely different from the traditional vacuum process for bonding, and creates a new bonding process technology to improve Production efficiency provides new ideas.
[0047] The non-vacuum state referred to in the present invention refers to a normal pressure state. Normal pressure is an atmospheric pressure, which is the pressure of the gas p...
Example Embodiment
[0106] Example 1
[0107] A method for preparing a touch display screen includes the following steps:
[0108] Step a): Obtain the thin film sensor 421 through processes such as yellow photolithography, screen printing or laser;
[0109] Step b): Use hot pressing technology to assemble the thin film sensor 421 prepared in step a) and the flexible circuit board 422 into a FOG module 42; during hot pressing, the hot pressing pressure is 2MPa, the hot pressing temperature is 155°C, and the hot pressing time is 9s;
[0110] Step c): Use the L-shaped alignment bonding technology to assemble the FOG module 42 prepared in step b) and the glass cover 41 into a touch screen 40; when the L-shaped alignment is attached, the pressure is 0.4MPa, and the bonding speed is 145mm / s; The L-shaped alignment lamination technology in this process uses a soft-to-hard lamination technology;
[0111] Step d): Attach one side of the optical glue 43 to the FOG module 42 of the touch screen 40 prepared in step...
Example Embodiment
[0114] Example 2
[0115] A method for preparing a touch display screen includes the following steps:
[0116] Step a): Obtain the thin film sensor 421 through processes such as yellow photolithography, screen printing or laser;
[0117] Step b): Use hot pressing technology to assemble the thin film sensor 421 prepared in step a) and the flexible circuit board 422 into a FOG module 42; during hot pressing, the hot pressing pressure is 2.3 MPa, the hot pressing temperature is 160 ℃ and the hot pressing time Is 10s;
[0118] Step c): Use the L-shaped alignment lamination technology to assemble the FOG module 42 prepared in step b) and the glass cover 41 into a touch screen 40; when the L-shaped alignment is attached, the pressure is 0.45MPa and the lamination speed is 150mm / s; The L-shaped alignment lamination technology in this process uses a soft-to-hard lamination technology;
[0119] Step d): Attach one side of the optical glue 43 to the FOG module 42 of the touch screen 40 prepare...
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