Semiconductor device manufacturing tool and method of manufacturing the same

Abstract

Semiconductor devices are manufactured using a cleaning process. The cleaning process uses a semiconductor manufacturing tool having a wet cleaning section and a plasma cleaning section. The semiconductor device is placed in a wet cleaning chamber within the wet cleaning section, where a wet cleaning process is performed. Once complete, and without disrupting the atmosphere, the semiconductor device is removed from the wet clean section and placed in a plasma clean chamber within the plasma clean section. Plasma cleaning is then performed. Embodiments of the present invention also relate to semiconductor device manufacturing tools and manufacturing methods thereof.

Description

technical field [0001] Embodiments of the present invention relate to semiconductor device manufacturing tools and methods of manufacturing the same. Background technique [0002] Semiconductor devices are used in various electronic applications such as, for example, personal computers, cell phones, digital cameras, and other electronic equipment. Semiconductor devices are typically manufactured by sequentially depositing an insulating or dielectric layer, a conductive layer, and a layer of semiconductor material over a semiconductor substrate and patterning the individual material layers using photolithography and etching processes to form circuit components and elements on the individual material layers . [0003] The semiconductor industry continues to improve the integration density of individual electronic components (eg, transistors, diodes, resistors, capacitors, etc.) through continuous reductions in minimum feature size, which allows more components to be integrate...

AI Technical Summary

Problems solved by technology

However, as the minimum feature size decreases, additional issues arise in each process used and should be addressed

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