Carrying device and carrying method thereof

Abstract

The invention provides a carrying device and a carrying method thereof. The carrying device comprises a movable transport mechanism, a grabbing mechanism, a bearing bench and a driving mechanism. Thecarrying method comprises the following steps: when the carrying device grabs an object to be carried from an object storage place or transfers the object to be carried to the object storage place, the transport mechanism moves to the object storage place, and a position, facing the object storage place, on a bearing surface is selected as a target pick-and-place area; the driving mechanism can drive the bearing bench to rotate horizontally and enables the bearing station meeting requirements to rotate to the target pick-and-place area; and the grabbing mechanism always picks and places the object to be carried on the bearing station of the target pick-and-place area. The carrying device and the carrying method thereof enable movement track of the grabbing mechanism to be same every time the grabbing mechanism grabs the object to be carried on the bearing station of the target pick-and-place area, thereby improving carrying efficiency of the carrying device.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a conveying device and a conveying method thereof. Background technique [0002] At present, some semiconductor manufacturing plants around the world generally use handling devices to move wafer boxes, instead of traditional manual handling. Especially the handling technology for 8-inch wafer boxes has become more and more mature, but the handling device for 12-inch wafer boxes is not common. Most of the existing handling devices use an Automated Guided Vehicle (AGV) with a robotic arm to move to a designated position, and then control the robotic arm to pick and place the wafer cassette according to the visual measurement results. [0003] figure 1 It is a schematic diagram of the high-level arrangement of the mechanical arm of a handling device, figure 2 for figure 1 The center of gravity distribution curve of the manipulator shown, image 3 It is a schematic di...

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to provide a handling device and a handling method to solve one or more of the problems in the prior art, such as low handling efficiency, small single handling volume and low stability for wafer cassettes

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